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New SEMI Technology Community to Help Drive Advanced Packaging and Heterogeneous Integration Innovation

To help the semiconductor industry keep pace with increasing chip performance and cost demands, SEMI has formed the Advanced Packaging Heterogeneous Integration (APHI) Technology Community as part of our longstanding support of advanced packaging innovation through events and standards development. 

SEMICON Japan Leaders: Industrywide Ecosystem Synergy Key to Advancing Digital Transformation

For the semiconductor industry to flourish, all chip ecosystems must embrace closer ties, greater openness, and more flexibility to co-innovate solutions in today’s rapidly unfolding global digital transformation.

SEMICON Sprint to 2022: Innovation, Sustainability, and Collaboration Highlights from SEMICON Europa Executive Forum

More than 4,000 participants convened in person at the four-day SEMICON Europa Expo in Munich, November 16-19. Attendees gathered at the Executive Forum for insights into the latest trends in the semiconductor industry and heartily welcomed the long-awaited return to in-person networking.

SEMICON Sprint to 2022: Back Onsite with 4 Events Over 7 Weeks

SEMICON Europa, SEMICON West, SEMICON Japan, & SEMICON Taiwan welcome back exhibitors and visitors to show floors starting in mid-November as four of SEMI’s seven flagship events gather visionaries and industry leaders to explore the latest semiconductor trends and innovations by the end of 2021.

Deploying Artificial Intelligence at the Edge: Key Takeaways from SEMI CTO Forum

Today, AI algorithms are primarily run at large data centers-- in the cloud. For this intelligence to be used at the edge, data must be transmitted to the cloud, analyzed there, and the results transmitted back to the field of operation, such as a mobile phone, medical implant or autonomous vehicle.

SEMI Taiwan Forum Takeaways: Heterogeneous Integration a Key Driver of 5G and AI Innovation

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid-...