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imec ITF Beyond 5G: Exploring Next-Gen Mobile Connectivity

Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany.

S2C Paves Way to Digital Innovation with Cutting-Edge Chip Design Verification Solutions

Founded in 2004, S2C’s worldwide customer base uses its desktop and enterprise field programmable gate array (FPGA) prototyping tools to verify system on chip (SoC) and application-specific integrated circuit (ASIC) designs will work as intended.

Deeper Collaboration Key to Continuing Semiconductor Innovation, Zero Defects for Automotive Industry

Antoine Amade, VP of sales for the Microcontamination Control division at Entegris, discusses innovation opportunities for semiconductor technologies entering the automotive domain, views on design and process engineering, and collaboration between the semiconductor and automotive industries.

3D-IC: Great Opportunities, Great Challenges

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.