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Focusing on Team and Culture With John Lee of Ansys

Cultivating trust and keeping his team agile and innovative as they engage with technology partners and customers is a core focus of John Lee, General Manager and Vice President of the Ansys Electronics, Semiconductors, and Optics Business Unit.

Wall Street’s Current View of EDA Industry With Jay Vleeschhouwer of Griffin Securities

The EDA industry has accelerated and growth has moved into double digits for the last number of years. Our forecast for 2023 is that we'll have another double-digit growth year to about $13 billion from more than $11.5 billion in total industry revenue last year.

It Will Take a Village to Solve Multiphysics

As an industry, we must collaborate because it’s going to take a village to solve Multiphysics, which in turn is the key to growth in 3D IC. No individual company can compete on every front.

Griffin Securities’ Jay Vleeschhouwer Offers Wall Street View of EDA Industry

Jay Vleeschhouwer, managing director of Griffin Securities, has followed the EDA industry as a leading financial analyst for 25 years and is a popular speaker at the annual Design Automation Conference. Vleeschhouwer discusses his DAC presentation The State of EDA: A View from Wall Street.

Needham & Company Senior Analyst Charles Shi on EDA Powering Through Semiconductor Industry Cycles

Charles Shi, Principal, Senior Analyst, Needham & Company, LLC., recently offered an upbeat assessment of the electronic design automation (EDA), silicon intellectual property (IP) and services industries, or what SEMI refers to as the electronic system design (ESD) ecosystem.

Open Platforms are the Foundation for Advanced System Design

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.

3D-IC: Great Opportunities, Great Challenges

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

Open Source EDA, IP, Cloud-Based Design, Extending Moore’s Law: Pedestal Research’s Laurie Balch Talks Chip Design Trends

As a leading analyst covering the electronic system design segment, Laurie Balch is well steeped in identifying and analyzing technology trends and forecasting new market opportunities. Laurie is now President and Research Director at Pedestal Research.

IC Design Crashes Into the 3D Wall: Multiphysics Platforms Ride to the Rescue

Three-dimensional integrated circuits (3D-ICs) are revolutionizing the semiconductor industry. Manufactured by stacking and interconnecting dies so they perform as a single device, 3D-ICs deliver more capabilities by offering higher performance and bandwidth — while also reducing power consumption,...

Exploring the Move to Bespoke Silicon and 3D IC Designs with Ansys

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...