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Griffin Securities’ Jay Vleeschhouwer Offers Wall Street View of EDA Industry

Jay Vleeschhouwer, managing director of Griffin Securities, has followed the EDA industry as a leading financial analyst for 25 years and is a popular speaker at the annual Design Automation Conference. Vleeschhouwer discusses his DAC presentation The State of EDA: A View from Wall Street.

Needham & Company Senior Analyst Charles Shi on EDA Powering Through Semiconductor Industry Cycles

Charles Shi, Principal, Senior Analyst, Needham & Company, LLC., recently offered an upbeat assessment of the electronic design automation (EDA), silicon intellectual property (IP) and services industries, or what SEMI refers to as the electronic system design (ESD) ecosystem.

Open Platforms are the Foundation for Advanced System Design

A critical foundation for success in this new multiphysics reality is the development of open, extensible and cloud-optimized platforms that enable many different tools and data sets to work together and build towards a realistic and accurate simulation of physical reality.

3D-IC: Great Opportunities, Great Challenges

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

Open Source EDA, IP, Cloud-Based Design, Extending Moore’s Law: Pedestal Research’s Laurie Balch Talks Chip Design Trends

As a leading analyst covering the electronic system design segment, Laurie Balch is well steeped in identifying and analyzing technology trends and forecasting new market opportunities. Laurie is now President and Research Director at Pedestal Research.

IC Design Crashes Into the 3D Wall: Multiphysics Platforms Ride to the Rescue

Three-dimensional integrated circuits (3D-ICs) are revolutionizing the semiconductor industry. Manufactured by stacking and interconnecting dies so they perform as a single device, 3D-ICs deliver more capabilities by offering higher performance and bandwidth — while also reducing power consumption,...

Exploring the Move to Bespoke Silicon and 3D IC Designs with Ansys

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...

How Artificial Intelligence and Machine Learning are Changing Simulation

Over the past 50 years, the field of engineering simulation has developed numerical methods that enable engineers to solve 3D physics problems faster, easier, with greater accuracy and more robust results. Finite element analysis (FEA), finite volume methods (FVM) and finite different time domain...