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Intel Sets Out to Tackle Power Delivery Challenges for Heterogeneous Systems

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are...

Exploring the Move to Bespoke Silicon and 3D IC Designs with Ansys

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through...

HP Singapore Smart Manufacturing Strategies to Optimize Production Flexibility and Efficiency

The state of manufacturing is changing rapidly. Regardless of sector or location, manufacturing decision-makers across the world are signaling a desire for better supply chain resiliency, manufacturing flexibility, increased speed of innovation and stronger environmental...

Chip Design Challenges: Driving the Need for Hardware-Assisted Verification

In the span of a few short months earlier this year, Mentor Graphics became Siemens EDA and introduced a suite of integrated hardware-assisted verification tools, the first product launch under the new Siemens EDA brand. Jean-Marie Brunet, senior director of marketing, product management and...

Embracing the New Buyer’s Journey

The adage “the only thing constant is change” has never been more universally applicable than this past year – across the globe, across industries, across buyers. All manner of ways in which we work and consume has changed and continues to change, driving innovation, disrupting industries, and...

SixSense Automates Visual Inspection to Boost Chip Defect Detection and Classification Accuracy

Traditionally, defect classification is done manually by operators or using Automated Optical Inspection (AOI) machines, often leading to classification inconsistencies. Also, rules-based AOIs may at times be unable to fully satisfy project requirements due to the rigidity of inspection...

Breaking Down Chip Design Functional Verification with Breker’s Adnan Hamid

Adnan Hamid, CEO, founder and visionary of Breker Verification Systems, an ESD Alliance member based in San Jose, Calif., once described his job in chip design verification at AMD as “breaking things.” When it came to naming his startup, Breaker was a natural choice. After some consideration, the...

How Artificial Intelligence and Machine Learning are Changing Simulation

Over the past 50 years, the field of engineering simulation has developed numerical methods that enable engineers to solve 3D physics problems faster, easier, with greater accuracy and more robust results. Finite element analysis (FEA), finite volume methods (FVM) and finite different time domain...

Smart Factory in Electronics Manufacturing: AI-based Closed-Loop Self-Optimization Platform

Introduction Automated production in electronics manufacturing can produce high-quality products, but it might lead to a particular failure without human interventions. With the rapid technology development, such as the Industrial Internet of Things (IIoT), big data analysis, cloud computing,...

Paying Tribute to the Semiconductor Industry

As we pass the work-from-home one-year mark, most of us still work remotely and will do so for the foreseeable future. As live trade shows and technical conferences were cancelled one after the other, virtual events became the norm. And, teleconferencing became a way of life. While possibly...