IC

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip.

Throughout the current millennium, System-on-Chip (SoC) has been the gold standard for optimizing performance and cost of complete electronic systems. By incorporating practically all the phone’s digital plus analog capabilities onto a single, giant chip, the mobile phone processor serves as a...