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Unleashing the Potential of Compound Semiconductors: Industry Leaders Collaborate at SEMICON Taiwan 2022 to Create Ecosystem

Leading experts gathered at the Power and Opto Semiconductor Forum at SEMICON Taiwan 2022 last year to discuss the growing importance of the devices in semiconductor innovation as the chip industry works to develop a robust compound semiconductor ecosystem.

When M&As and Venture Capital Become Key to Corporate Growth: Takeaways from SEMI Taiwan Executive Luncheon

With the emergence of consolidation as a potent engine of semiconductor industry growth, global mergers and acquisitions are sweeping the industry as companies look to accelerate advances across segments including data centers, AI, IoT and automotive chips.

imec ITF Beyond 5G: Exploring Next-Gen Mobile Connectivity

Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany.

Comet Yxlon: The Future of Advanced Packaging is X-Ray

SEMI spoke with Christian Driller, Vice President of Research and Development at Comet Yxlon, about opportunities to accelerate time-to-market and increase yield for advanced packaging manufacturers through x-ray inspection.

Atomic Layer Deposition Expected to Grow to Meet Demand for More-than-Moore Devices and Applications

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

Conquering 2.5D and 3D Chip Design Challenges with Monozukuri

Anna Fontanelli, Monozukuri’s founder and CEO, is an expert in deep-submicron silicon technology and design tools shares her view on the state of Moore’s Law and challenges surrounding 2.5D integration, 3D chip stacking & advanced packaging, as well as the chip design industry’s startup environment.

For Moore’s Law to Live, SoCs Must Die

Throughout the current millennium, System-on-Chip (SoC) has been the gold standard for optimizing performance and cost of complete electronic systems. By incorporating practically all the phone’s digital plus analog capabilities onto a single, giant chip, the mobile phone processor serves as a...

Throwing a Curveball: Will Future ICs Be Designed Using Curvilinear Shapes Instead of Rectangles?

A change is underway in the manufacturing sector as the use of curvilinear shapes on photomasks grows, leading to the real possibility of curvilinear shapes in designs. It may just be the start of a revolution away from Manhattan or rectangular shapes to curvilinear shapes. Changing the physical...

Industry Expert Q&A –The Key to Chip Security: Trust and Verify! But How?

Even though microchips continue to get smarter, vital security gaps continue to be exposed through such hack attacks as Meltdown, Spectre, and in recent weeks, Plundervolt. Researchers continue to discover open doors in chip architectures for malicious players to steal increasingly sensitive data,...

AEM Global Diversification Key to Business Continuity During COVID-19 Pandemic

The COVID-19 pandemic has inflicted major impacts on manufacturing operations worldwide including in the semiconductor industry. The virus has left millions of people confined to their homes, resulting in a massive shift to virtual work and online engagement. In Singapore, where AEM is...