Munich

Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels.

SEMI spoke with Anja Maria Muesch and Dr. Philip Matthes at Merck KGaA, Darmstadt, Germany about the challenges and opportunities of generational diversity in the electronics industry workforce.

Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany.

MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster point-of-care testing to microfluidics-based...

The combination of state-of-the-art semiconductor devices and upcoming manufacturing technologies for cost-effective processing of flexible film substrates has paved the way for a large variety of new applications in the emerging Flexible Hybrid Electronics (FHE).SEMI spoke with Professor Christoph...

SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” and the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018, 13-16, November...

SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at the 22nd Fab Management...

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018, 13-16, November 2018, in...

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced Packaging...