Technology and Trends

SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach.

Thanks to a combination of proprietary algorithms, advanced sensor fusion and the natural geomagnetic field, GipStech, a spin-off of Università della Calabria, built an indoor localization and navigation technology platform for accurate localization in the absence of an adequate GPS signal.

The SEMI Talent Forum, 2-3 May, 2019 in Bristol, UK will explore new opportunities and challenges of the digital era and the industry’s need for talent and the knowledge and skills in automation, computerization and digitization to drive tech innovation.

SEMI spoke with Andy Collins, manager at Quantum Technology Enterprise Centre (QTEC), ahead of the SEMI Talent Forum (2-3 May, 2019, in Bristol, UK) about the impact of emerging technologies on the future of work in the semiconductor industry.

SEMI spoke with Mark Purdy about Accenture’s Business Futures – four different future worlds set in 2025 based on the collision of trends across demographics, geopolitics, technology, and economics – and what these futures will mean for markets, workforces, operating models & industry value chains.

SEMI spoke with GreenWaves Technologies CEO and co-founder Loïc Lietar about the semiconductor start-up and its Internet of Things (IoT) ultra-low-power processing technology ahead of SEMI Europe Industry Strategy Symposium (ISS Europe).

SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering, in-process warp control, as well as the associated production methodology that provides rapid prototyping & high-volume manufacturing.

SEMI met with Erez Halahmi, VP at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in Dresden, Germany.

SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape.