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German Research Institute Drives Flexible Electronics Innovations

SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.

A New Collaborative Approach to Automobile Industry Reliability Challenges

SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” & the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018 in Munich, Germany.

Takeaway Trends from European MEMS & Sensors Summit

Data management tools need to become whip-smart, multi-sensor packages are the real deal, and a renewed emphasis on safety has thrust ADAS sensor systems into the spotlight. These were among the latest industry insights shown during European MEMS & Sensors Summit and Imaging & Sensors Summit.

MEMS – One Product, One Process?

SEMI spoke with Udo Gómez, SVP at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at SEMICON Europa 2018 in Munich, Germany.

Automating 200mm Semiconductor Fabs to Meet Growing Demand

SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions.

Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.

3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies & their need for new materials and integration solutions. The two talked ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.

Sensors - From Red Hot Chillies to Patients

Sensors enable a myriad of sensors and applications, from measuring caffeine in coffee and the hotness of chillies and ions in the blood of patients, to the detecting sulfite levels in wine. Zimmer and Peacock Director Martin Peacock reveals the hottest application today.

Sensor Fusion: Enabling Devices to be Aware of Their Surroundings

SEMI spoke with Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG, about how the sensing capabilities of machines are getting ever closer to the five human senses, allowing machines to comprehend the environment before acting.

AI at the Edge: Making Always-on Machine Vision a Reality

SEMI's Serena Brischetto chats with Qualcomm Technologies Senior Director of Engineering Evgeni Gousev about AI at the edge imperatives and devices ahead of the European MEMS & Sensors and Imaging & Sensors Summits.