Smart Manufacturing Standards

The SEMI Standards Program brings together experts to exchange ideas and work towards developing globally accepted technical standards.

Starting from the SECS (SEMI Equipment Communications Standard) and GEM (Generic Model for Communications and Control of Manufacturing Equipment) standards, and more recently with Equipment Data Acquisition standards, the SEMI Standards Program has served as the platform for development of advanced automation standards enabling Smart Manufacturing across the microelectronics industry.

Today, the Information & Control and Automation Technology Global Technical Committees continue to develop new Standards, examining topics such as energy conservation, traceability, automation of back-end processing, and manufacturing equipment communication interfaces for printed circuit boards and related industries.

COMMUNICATION PROTOCOLS

• SEMI E4-0418 — Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
• SEMI E5-0622 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
• SEMI E37-0222 — High-Speed SECS Message Services (HSMS) Generic Services
• SEMI E39-1218 — Object Services Standard: Concepts, Behavior, and Services

EQUIPMENT CONTROL

• SEMI E30-0520 — Specification for the Generic Model for Communications & Control of Manufacturing Equipment (GEM)
• SEMI E40-1218 — Standard for Processing Management
• SEMI E84-1109 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
• SEMI E87-0921 — Specification for Carrier Management (CMS)
• SEMI E90-0921 — Specification for Substrate Tracking
• SEMI E94-0314 — Specification for Control Job Management

EQUIPMENT DATA ACQUISITION & PROCESS DIAGNOSTICS

• SEMI E120-0922 — Specification for the Common Equipment Model (CEM)
• SEMI E125-1022 — Specification for Equipment Self Description (EqSD)
• SEMI E128-0414 — Specification for XML Message Structures
• SEMI E132-0922 — Specification for Equipment Client Authentication and Authorization
• SEMI E134-1022 — Specification for Data Collection Management
• SEMI E138-0217 — Specification for XML Semiconductor Common Components
• SEMI E164-0414 — Specification for EDA Common Metadata
• SEMI E178-0120 — Guide for EDA Freeze Version
• SEMI E179-0822 — Specification for Protocol Buffers Common Components

ADVANCED ANALYTICS AND PROCESS CONTROL

• SEMI E116-0518 — Specification for Equipment Performance Tracking
• SEMI E126-0708 — Specification for Equipment Quality Information Parameters (EQIP)
• SEMI E133-1218 — Specification for Automated Process Control Systems Interface
• SEMI E157-0611 — Specification for Module Process Tracking

DATA MANAGEMENT

• SEMI E151-1211 — Guide for Understanding Data Quality
• SEMI E160-1211 — Specification for Communication of Data Quality
• SEMI E172-0320 — Specification for SECS Equipment Data Dictionary (SEDD)
• SEMI E173-0721 — Specification for XML SECS-II Message Notation (SMN)

AUTOMATED TEST EQUIPMENT

• SEMI E183-1121 - Specification for Rich Interactive Test Database (RITdb)
• SEMI A4-0821 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)

CYBERSECURITY

• SEMI E187-0122 - Specification for Cybersecurity of Fab Equipment
• SEMI E188-0222 - Specification for Malware Free Equipment Integration

SURFACE-MOUNT TECHNOLOGY ASSEMBLY LINES AUTOMATION [SMT-ELS]

• SEMI A1 — Specification for Horizontal Communication (HC) Between Equipment for Factory Automation System             
• SEMI A1.1 — Specification for Media Interface for A Horizontal Communication (HC) Between Equipment
• SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH) 

AUTOMATION FOR ADJACENT INDUSTRIES

• SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
• SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
• SEMI PV2 - Guide for PV Equipment Communication Interfaces (PVECI)

Articles

• Big Data Transfers with the EDA / Interface A SEMI Standards Suite (December 2021)

Future Topics to Support Smart Manufacturing

• Data security
• Big data integration
• Virtual Metrology
• Predictive Analytics
• Digital Twin
• Supply chain integration
• Data and IP partitioning