GRENOBLE, France – August 2, 2022 – More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain at SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022 at the World Trade Center (WTC) in Grenoble, France. The event will also highlight key MEMS and sensors innovations spurring industry growth and opportunities for diversifying the semiconductor workforce. Registration is open.
Themed Intelligent Sensing for Better and Smarter Living, SEMI MEMS & Imaging Sensors Summit will feature leading companies, technologies, and innovators driving the future of MEMS and imaging sensors design and manufacturing. The event is hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community.
“SEMI MEMS & Imaging Sensors Summit will gather influential industry stakeholders to explore compelling innovation opportunities and technological developments that will drive intelligent sensing advancements for better and smarter living,” said Laith Altimime, president of SEMI Europe. “We look forward to hosting global industry leaders as they network and collaborate across the supply chain and market segments – from transportation and industrial to biomedical – to help promote industry growth.”
Executive Keynotes
Keynote speakers will focus on MEMS and imaging sensor innovations driving an explosion of Smart applications across medical, mobility, communications and other sectors.
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Marco Cassis, President, Analog, MEMS and Sensors Group, STMicroelectronics |
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Sébastien Dauvé, CEO, CEA-Leti |
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MEMS & Imaging Sensors Summit Sessions
Session 1: A Diverse and Sustainable Workforce Enabling Next Generation Innovation
Industry leaders will explore how workforce diversity can help spur innovation and ways companies and corporate leaders can create an inclusive environment where employees can thrive
Session 2: Market Brief
Industry trends, market drivers and supply chain dynamics will come into focus.
Session 3: Intelligent Sensing
Presentations will highlight new sensor technologies that enable fast, reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.
Session 4: Materials and Equipment Advancements
Experts will discuss how materials and equipment advances are enabling higher performance MEMS devices for new manufacturing techniques and equipment.
Session 5: Emerging Applications
Experts will share their visions for emerging sensor applications and discuss the latest developments in biosensors, MEMS, photonics and spectroscopic technologies.
Session 6.1: MEMS Advancements
Industry leaders will discuss new MEMS technology applications, devices and manufacturing trends. Application topics will include the integration of multiple sensors into System in Package (SiP), MEMS for medical sensing, and system integration of data generation and data processing. Manufacturing topics will include advancements enabling 300mm wafer sizes, 3D integration and substrate diversification.
Session 6.2: Imaging Advancements
Industry leaders will share their visions for sensing processes, design and computing.
Session 7.1: Environmental MEMS Technologies
Experts will discuss future environmental MEMS technologies that promise to drive advances in processes ranging from preventative maintenance and quality control to environmental monitoring.
Session 7.2: SWIR Imaging Innovations
This session will explore the latest advancements in traditional Short-wave infrared (SWIR) imaging technology from Lynred and the promise of new quantum dot SWIR from STMicroelectronics and Emberion. imec will discuss how more affordable sensors are enabling new consumer applications, and VTT will introduce a low-cost solution for SWIR hyperspectral imaging.
Session 8: Optics, Co-Packaged Optics (CPO) and Optical Chips Packaging for MEMS and Imaging Sensors
Industry leaders will explore the integration of optics and silicon through Co-Packaged Optics (CPO) to meet growing performance and power efficiency demands stemming from the rapid growth of cloud data.
Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit
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Premier Sponsors
- Platinum: ASE, Inc., Bühler, Infineon, KLA, SCHOTT
- Gold: Evatec, SÜSS MicroTec
- Silver: AEM
- Event: Caeleste, EV Group (EVG), JSR Micro N.V., Okmetic Oy, Teledyne
For more information, please visit the SEMI MEMS & Imaging Sensors Summit website.
Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope
About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.
Association Contact
Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: sbrischetto@semi.org