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Comet Yxlon: The Future of Advanced Packaging is X-Ray

SEMI spoke with Christian Driller, Vice President of Research and Development at Comet Yxlon, about opportunities to accelerate time-to-market and increase yield for advanced packaging manufacturers through x-ray inspection.

Atomic Layer Deposition Expected to Grow to Meet Demand for More-than-Moore Devices and Applications

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

New Holistic Chemical Approach Boosts Heterogeneous Integration Reliability for 5G

SEMI spoke with Markus Hörburger, global product manager, Atotech Deutschland GmbH, about Atotech’s holistic approach to improving the reliability of advanced heterogeneous packaging through innovative chemistry solutions for fan-out wafer-level packaging (FOWLP) in 5G applications.

Multi-Sensor Metrology Tools for Hybrid Metrology

SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach.