장비 시장
개요
반도체 장비는 보통 공장이라고 하는 제조 시설에 있는 통합 장비 제조(I.C.s)에 있어서 중요한 역할을 합니다. 반도체 장치의 종류 또는 카테고리는 다음과 같습니다.
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제품
SEMI의 업계조사 및 통계에서는 다음과 같은 이점을 제공하는 시장데이터를 제공합니다:
- 보다 신속한 정보 제공으로 경쟁 우위 확보
- 비즈니스 계획, 전략적 계획, 및 예측에 관한 보다 빈번한 조언
- 이순환형 산업에 대한 더 나은 이해
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023, SEMI Reports (April 10, 2024)
Global Semiconductor Manufacturing Industry Poised for 2024 Recovery, SEMI Reports (February 14, 2024)
Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports (December 12, 2023)
Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports (November 30, 2023)
Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports (November 13, 2023)
Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports (August 15, 2023)
Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports (April 12, 2023)
Equipment
Semiconductor Manufacturing Monitor
Equipment Market Data Subscription (EMDS)
Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Historical Report (1991-2023)
Historical Book-to-Bill Report (1991-2016) and Billings Report (2018-2023)
SEMI Industry Research and Statistics delivers powerful market data intelligence that enables you to:
- Stay ahead of your competition by being more quickly informed
- Obtain more frequent input for business planning, strategic planning and forecasting
- Get a better understanding of this cyclic industry
리소스
2020 North America Semiconductor Equipment Billings Report Release Dates
Equipment Forecast Definitions
Equipment Related Press Releases/Articles
SEMI Equipment Brief: Test Equipment (PDF)
There are various types of electrical and reliability tests conducted at different stages of assembly and for different purposes once the wafer fabrication process is finished. Tests include die sort test on wafers, electrical and environmental testing, and burn-on on packaged devices.
SEMI Equipment Brief: Wafer Fab Brief (PDF)
Semiconductor fabrication consists of a series of processes in which a device structure is manufactured by applying a series of layers onto a substrate, most commonly on silicon. This involves the deposition and removal of various thin film layers. The areas of the thin film that are to be deposited or removed are controlled through photolithography. Each deposition and removal process is generally followed by cleaning as well as inspection steps.
SEMI Equipment Brief: Other Front-End Equipment Brief (PDF)
Other Front-End equipment is "catch-all" phrase for equipment that is used in front end manufacturing but not in wafer processing. It includes: Wafer Manufacturing equipment, Photomask/Reticle equipment and Fabrication Facility equipment.
SEMI Equipment Brief: Assembly and Packaging (PDF)
There are two main purposes for assembling the bare semiconductor device into a package. First, the package provides mechanical and environmental protection to the bare die. Second, the package provides and electrical connection between the die and the printed circuit board (PCB). Nowadays, there are tremendous number of package types, form factors, and process techniques used in assembly packaging.
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