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November 14, 2024 - November 15, 2024

MEMS logo

#MEMS #imaging #sensors

Ubiquitous Sensing for a Sustainable World

Time

8:00 am - 6:00 pm

Add to Calendar 2024-11-14 08:00:00 2024-11-15 18:00:00 MEMS & Imaging Sensors Summit #MEMS #imaging #sensors Ubiquitous Sensing for a Sustainable World Messe München Munich Germany SEMI.org contact@semi.org America/Los_Angeles public
Location

Messe München
Munich
Germany

MEMS logo

 

SEMI MEMS & Imaging Sensors Summit Moves to Munich at SEMICON Europa 

SEMI MEMS & Imaging Sensors Summit will relocate to SEMICON Europa, co-located with productronica in odd-numbered years and electronica in even-numbered years at Messe München in November. 

Connect is at the heart of SEMI’s mission. This move enables an entirely new scale of connection. SEMICON Europa with its co-locations productronica/electronica equals the largest electronics design and manufacturing exhibition and conference event in Europe, with more than 75,000 expected attendees. This relocation means more people, more opportunities, and more connections. 

For this reason, MEMS & Imaging Sensors Summit 2024 will take place November 14-15 at the International Conference Center Munich (ICM), Messe Münich in Germany.

Learn more about this relocation here

 

 

FEATURED SPEAKERS 2023

MEMS 2023 Distinguished Speakers

 

SPONSORS 2023

MEMS 2023_Sponsors

Welcome to our highly anticipated SEMI MEMS & Imaging Sensors Summit! We are thrilled to once again bring together an extraordinary lineup of distinguished speakers from some of the most innovative and inspiring companies in the industry.

This exceptional event offers an extensive program of activities, including exhibitions, in-person business-to-business matchmaking opportunities, and a chance to connect with like-minded professionals to discuss new business ventures.

Our summit provides a unique opportunity to gain unparalleled insights into the latest MEMS & Imaging technologies and how they can significantly impact future product developments and applications. With the rapid advancement in the development, manufacturing, integration of MEMS and image sensors, and their ingenious utilization with AI/ML or data fusion, we are on the cusp of a new wave of groundbreaking applications.

Drawing from this progress, our esteemed speakers will delve into the new opportunities on the horizon and share their vision of how such advancements will enable a smarter and more sustainable future.

We extend a warm invitation to all companies that are currently creating new products and services based on MEMS & Imaging sensors, as well as those involved in the manufacturing, testing, integration, and design of such sensors, to join us at this outstanding event. It is an excellent opportunity to be a part of the journey toward unlocking the full potential of these sensors and their capacity to revolutionize the technology industry.

Philippe Monnoyer, VTT Technical Research Center of Finland Ltd

Looking forward to seeing you there,

MEMS & Imaging Committee Chair,

Philippe Monnoyer, VTT Technical Research Center of Finland Ltd

Agenda

DAY 1 | Tuesday, September 19

The market for MEMS and imaging sensors is being propelled by several megatrends in various industries, including the increasing electrification of vehicles, advanced driver assistance systems (ADAS), and the demand for augmented and virtual reality technologies in the consumer electronics industry. In this session, experts will discuss these market growth drivers, as well as the latest technological innovations and future trends. Attendees will gain valuable insights into the opportunities and challenges facing the MEMS and imaging sensor industry and learn how to capitalize on these trends to drive growth and innovation in their companies.

4:00 pm - 4:20 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Welcome Remarks

4:20 pm - 4:40 pm
Hod Finkelstein
Hod Finkelstein
Head of Cameras and Depth, Reality Labs
Meta

Imaging for a Mixed-Reality Future

4:40 pm - 4:50 pm
Philippe Monnoyer
Philippe Monnoyer
Customer Account Lead – Hyperspectral & Microelectronics
VTT

Welcome Remarks by Session Chair

4:50 pm - 5:10 pm
Kilian Bilger
Kilian Bilger
Vice President Engineering Sensor Components
Robert Bosch GmbH

Automated – Electrified – Connected: Chances and Challenges for Automotive MEMS

5:10 pm - 5:30 pm
Isabella Drolz
Isabella Drolz
VP Product Marketing
Comet Yxlon

Overcoming the Semiconductor Talent Shortage

5:30 pm - 5:50 pm
Pekka Kostiainen
Pekka Kostiainen
Senior Manager, Business Development
Murata Electronics Oy

Software Defined Vehicle – Opportunities for Inertial MEMS

5:50 pm - 6:00 pm
Tim Brosnihan
Tim Brosnihan
Executive Director, MEMS & Sensors Industry Group, Fab Owners Alliance
SEMI

MEMS & Sensors Industry Group Update

6:00 pm - 6:10 pm
Philippe Monnoyer
Philippe Monnoyer
Customer Account Lead – Hyperspectral & Microelectronics
VTT

Key Takeaways by Session Chair

6:10 pm - 6:20 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

6:20 pm - 9:30 pm

Location: World Trade Center, Grenoble, France

DAY 2 | Wednesday, September 20

In the semiconductor value chain, there is an urgent need to introduce more flexible and sustainable manufacturing solutions to fulfill ecological goals as well as market expectations at the same time. The focus of this session is to demonstrate proven approaches to enable all stakeholders to work towards and achieve industry sustainability goals and pave the way to Net Zero.

9:00 am - 9:10 am
Marc Hennemeyer
Marc Hennemeyer
Director Lithography Application Center
SÜSS MicroTec

Welcome Remarks by Session Chair

9:10 am - 9:30 am
Bernard Kress
Bernard Kress
Director, Optical Engineering - AR hardware
Google

Novel Display and Sensor Architectures for Small Form Factor AR Goggles

9:30 am - 9:50 am
Konrad Semmler
Konrad Semmler
Director Process Integration (PI)
Globalfoundries Fab1 Dresden

Benchmark Prototyping in an advanced CMOS Foundry

9:50 am - 10:10 am
Thomas Russell
Thomas Russell
CEO
Mesoline

Mesoline’s Microchannel Particle Deposition Used for Sensing Elements, Getters and Electrochemical, Porous Electrodes

10:10 am - 11:10 am

Coffee Break

Okmetic
11:10 am - 11:30 am
Bernhard Hammerl
Bernhard Hammerl
Head of Business Development
Siconnex Customized Solutions GmbH

Siconnex Delivers a More Sustainable Future

11:30 am - 11:50 am
Roux
Nicolas Roux
Product Line Manager - Imaging Camera Sensors
STMicroelectronics

Image Sensing beyond Photography - New Imaging Sensors for New Usages

11:50 pm - 12:00 pm
Marc Hennemeyer
Marc Hennemeyer
Director Lithography Application Center
SÜSS MicroTec

Key Takeaways by Session Chair

12:00 pm - 1:05 pm

Networking Lunch

Sponsored by Teledyne MEMS

Teledyne MEMS

Many exciting new MEMS applications and device concepts are emerging. This session will address MEMS technology's latest developments and trends, including roadmaps and market forecasts. A particular focus will also be given to audio technologies, novel biosensing concepts, and manufacturing challenges.

1:05 pm - 1:10 pm
Bernd Dielacher
Bernd Dielacher
Business Development Manager, MEMS
EV Group

Welcome Remarks by Session Chair

MEMS Parallel Sessions
1:10 pm - 1:30 pm
Pierre-Marie Visse
Pierre-Marie Visse
Senior Analyst for MEMS & Sensors
Yole Group

Exploring the Latest and Future MEMS Trends for a Smarter World

1:30 pm - 1:50 pm
Christophe Zinck
Christophe Zinck
Director, Technical Program Managment
ASE, Inc.

Advanced packaging for MEMS & Sensor innovations

1:50 pm - 2:10 pm
Julia Brueckner
Julia Brueckner
Global Applications & Product Engineering Manager for the Packaging & Wafer Business Unit
Corning Incorporated

Glass Innovations for MEMS Applications

2:10 pm - 2:30 pm
Marc Sansa
Marc Sansa
R&D Project Manager
CEA-Leti

Enabling High Efficiency Sensing with Optomechanical Devices

2:30 pm - 2:50 pm
Moti Margalit
Moti Margalit
CEO
SonicEdge

Sound Generation by Active Modulation of Ultrasound

2:50 pm - 3:10 pm
Heinrich Heiss
Heinrich Heiss
Distinguished Engineer 3D Sensing
Infineon

New Piezo Materials for Audio Devices

3:10 pm - 3:15 pm
Bernd Dielacher
Bernd Dielacher
Business Development Manager, MEMS
EV Group

Key Takeaways by Session Chair

Covering the upcoming developments and applications of image sensing, this session is an opportunity to learn about the variety of areas where imaging is making a difference in everyday life. From assisting medical diagnoses, monitoring the planet's condition, and being fundamental to autonomous vehicle capability, these sensors require leading-edge design, novel materials, and manufacturing methods. Interpreting the data generated by these devices is also critical, requiring growing expertise in creating the software algorithms necessary to act on the findings.

1:05 pm - 1:10 pm
Richard Barnett SPTS
Richard Barnett
Director of Etch Product Management
SPTS Technologies Ltd., a KLA company

Welcome Remarks by Session Chair

MEMS Parallel Sessions
1:10 pm - 1:15 pm
Jan Vermeiren
Jan Vermeiren
Business Development Manager
Caeleste

Image Sensor Optimization for Different Wavelengths

Caeleste
1:15 pm - 1:35 pm
Andre Henning
André Henning
Head of R&D
Siemens Healthineers

Photon-Counting Computed Tomography (PCCT) in the Development of X-Ray Based Medical Imaging

1:35 pm - 1:55 pm
Gerry Conway
Gerry Conway
Senior Expert
Valeo

Automotive Vision Cameras - Challenges and Opportunities

1:55 pm - 2:15 pm
Martin Cornil
Martin Cornil
FPGA Engineer
Aerospacelab

Newspace Multi-Spectral Imaging

2:15 pm - 2:35 pm
Joost van Beek
Joost van Beek
Manager MEMS Process Development & Integration
Philips Engineering Solutions

MEMS Based Ultrasound Imaging for Medical Applications

2:35 pm - 2:55 pm
Jan Jakubek
Jan Jacubek
CSO & Co-founder
Advacam

The Fully Spectroscopic Single Photon Counting Cameras for Science and Industry

2:55 pm - 3:05 pm
Joscha Malin
Joscha Malin
Director Product Marketing Software Solutions
Comet Yxlon

The Future of Advanced Packaging Inspection is X-Ray!

3:05 pm - 3:10 pm
Richard Barnett SPTS
Richard Barnett
Director of Etch Product Management
SPTS Technologies Ltd., a KLA company

Key Takeaways by Session Chair

3:10 pm - 3:55 pm

Coffee Break

Okmetic

Many systems rely on multiple sensor inputs from various tracks, interpret, and then react to the relevant information. This session will demonstrate the capabilities of sensors nowadays in reducing uncertainty and reaching sufficient accuracy for most applications.

3:55 pm - 4:00 pm
Jean-Luc Jaffard
Jean-Luc Jaffard
VP Hardware
Prophesee

Welcome Remarks by Session Chair

4:00 pm - 4:20 pm
Julien Mottin
Julien Mottin
VP Products
Prophesee

Unlocking Next Generation Mobile Imaging: Fusion EVS+RGB

4:20 pm - 4:40 pm
Martin Croome
Martin Croome
Vice President of Marketing
GreenWaves Technologies

Enabling Intelligent Hearables and Wearables: GreenWaves' Ultra Low Power Processors

4:40 pm - 4:45 pm
Jean-Luc Jaffard
Jean-Luc Jaffard
VP Hardware
Prophesee

Key Takeaways by Session Chair

In order to track, monitor, automate, and analyze operations in agriculture, the industry needs to have infrastructure that leverages state-of-the-art technology. The session will focus on how using these systems can make operations more predictable and efficient.

4:45 pm - 4:50 pm
Eric Mazaleyrat.png
Eric Mazaleyrat
Technology Scouting and Innovation Director
STMicroelectronics

Welcome Remarks by Session Chair

4:50 pm - 5:10 pm
Heinz Bernhardt
Heinz Bernhardt
Professor
TU Munich

Challenges for Sensors and Actuators due to Automation in Agriculture

5:10 pm - 5:30 pm
Mark Zentile
Mark Zentile
Optical Engineer
OnePlanet Research Center

Integrated Photonics as an Enabler of Autonomous Agriculture

5:30 pm - 5:50 pm
Debra Deininger
Debra Deininger
Chief Revenue Officer
N5 Sensors

Improving Health and Safety with the Fifth Digital Sense

5:50 pm - 5:55 pm
Eric Mazaleyrat.png
Eric Mazaleyrat
Technology Scouting and Innovation Director
STMicroelectronics

Key Takeaways by Session Chair

5:55 pm - 6:05 pm

Beneq Lucky Draw

Beneq
6:05 pm - 6:10 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

7:00 pm - 11:00 pm

Location: Château de Sassenage, Allée du Château - 38360 Sassenage

Dress code: Business Smart

Upon availability, gala dinner tickets can be purchased onsite. Ask the SEMI staff for support.

If you have any questions, please contact euevents@semi.org.

MEMS Gala Dinner 2019

DAY 3 | Thursday, September 21

Through disruptive technologies, in recent years, progress was made in materials, processes, and equipment areas to support semiconductors' innovative breakthroughs. This session will demonstrate the benefits of semiconductors in promoting a sustainable future that does not compromise the present.

9:00 am - 9:10 am
Florian Dom
Florian Domengie
Senior Technology and Market Analyst
Yole Group

Welcome Remarks by Session Chair

9:10 am - 9:30 am
Philippe Andreucci
Philippe Andreucci
CEO
InjectPower

New Generation of Ultra Miniaturized, High Energy Density and Rechargeable Micro Batteries for Medical Applications

9:30 am - 9:50 am
Abul Nuruzzaman
Abul Nuruzzaman
Vice President, Technology & IP Licensing
Adeia, Inc.

Hybrid Bonding Innovation to Adoption

9:50 am - 10:00 am
Christophe Vautey
Christophe Vautey
Innovation Project Manager
CEA-Leti

AddVISIA: A Platform to Explore Multimodal Imaging and Fusion Capabilities

10:00 am - 10:10 am
Vijay Ramya Kolli
Vijay Ramya Kolli
Program Manager for Imprint Technologies
SÜSS MicroTec

Manufacturing High-Quality Micro and Nano Optical Elements with a Compact 300mm Imprint Platform

10:10 am - 10:30 am
Stijn Witteveen
Stijn Witteveen
Head of product management, Public segment DDS S&S
Signify

Smart Connected Public Lighting for a Smarter, Safer and Sustainable World

10:30 am - 10:35 am
Florian Dom
Florian Domengie
Senior Technology and Market Analyst
Yole Group

Key Takeaways by Session Chair

10:35 am - 11:20 am

Coffee Break

Teledyne MEMS

This session focuses on how photonics enables sensing and vision applications in several areas and how the increasingly complex photonic chips must be integrated since they are a vital part of the value chain. Integrating these photonic devices will allow the components to work seamlessly together which leads to faster chips, and more efficient while using less power.

11:20 am - 11:25 am
Francois Simoens
Francois Simoens
CEO and Co-founder
Steerlight

Welcome Remarks by Session Chair

11:25 am - 11:45 am
Theodor Nielsen
Theodor Nielsen
CEO
NILT

Meta Optical Elements Product by Nanoimprint Lithography

11:45 am - 12:05 am
Lia Li
Lia Li
CEO and Founder
Zero Point Motion

Silicon Photonics to Enhance MEMS Inertial Sensing

12:05 am - 12:25 pm
Martin Peyrou
Martin Peyrou
R&D Engineer
Silicon Photonics

III-V Semiconductor Lasers and Amplifiers Monolithically Integrated on the Backside of Standard Silicon Photonics for Single-Chip FMCW Lidar Solutions

12:25 pm - 12:30 pm
Francois Simoens
Francois Simoens
CEO and Co-founder
Steerlight

Key Takeaways by Session Chair

12:30 pm - 12:35 pm
Philippe Monnoyer
Philippe Monnoyer
Customer Account Lead – Hyperspectral & Microelectronics
VTT

End of Conference Reflections by MEMS & Imaging Committee Chair

12:35 pm - 12:45 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

12:45 pm

End of Conference

REGISTRATION

MEMS 2022 Summary image

Registration fees *:

  • SEMI Members: 950 EUR
  • Non-members: 1,250 EUR
  • Students: 85 EUR

* VAT excl.

Registration fee includes:

  • Access to all MEMS & Imaging Sensor Summit sessions
  • Access to the exhibition area
  • Conference Proceedings
  • Coffee breaks and lunches are mentioned in the agenda section of the conference website
  • Networking reception on Tuesday, September 19, 2023

Location: Château de Sassenage, Allée du Château - 38360 Sassenage

Date: Wednesday, September 20, 2023

Pricing: 149 EUR*

* VAT excl.

Upon availability, gala dinner tickets can be purchased onsite. Ask the SEMI staff for support.

If you have any questions, please contact euevents@semi.org.

 

Whether you are already part of the MEMS, imaging and sensors ecosystem, a consumer of these devices, or perhaps a startup aiming to be the next Unicorn, you should not miss this opportunity to connect with industry executives and experts from around the globe.

Attendees are invited to take advantage of excellent intentional networking opportunities which have become a highlight of the Summit. The exclusive exhibition area, which always sells out quickly, uniquely showcases the most prominent names in the industry alongside new and innovative smaller companies.

Check out the Post Show Report!

Proceedings will be available shortly after the Summit. 

To have access to them, please fill out the short satisfactory survey that you will receive by email after the Summit. After completion of this survey, the password for the download will appear on the very last page.

For any questions, please contact programseu@semi.org.

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MEMS 2022 Summary image

Exhibition

MEMS 2023 Floorplan (Updated)

Exhibitors 2023     Book a Booth

Exhibition fee:

  • SEMI Member: 3,250 EUR
  • Non-Member: 3,750 EUR

*All prices in Euros, VAT excluded (20% French VAT applied when registering)

Modular booth includes:

  • Aluminium structure with melamine panels
  • A4 sign with company name
  • 1 table and 2 chairs
  • 1 power socket
  • 3 spotlights
  • 1 trash can

Exhibition fee includes:

  • 4m2 Turnkey booth
  • Free conference access for one person (access to all plenary sessions, exhibition, lunches, and proceedings)
  • 6 complimentary tickets for DAY 1 to invite your customers and partners
  • The possibility to get one discounted ticket

Exhibition Package

If you have any questions, please contact the events team at euevents@semi.org

MEMS 2023 Floorplan (Updated)

Travel

 

Accommodation:

We have pre-reserved call-in allotments at your disposal. 

Feel free to explore the options with our official partner hotels that offer options without booking fees. 

Rooms and rates are subject to availability.

Reserve now

 

Event Venue:

World Trade Center

5-7 Place Robert Schuman
38000 Grenoble, France

Sponsors

Platinum

Gold

Event

Sponsorship Opportunities

Sponsorship of MEMS & Imaging Sensors Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships. 

Contact: Adi Hodorov at ahodorov@semi.org

Sponsorship Package Sponsorship Agreement Post Show Report 2023

 

 

Are You Already a Sponsor?

Make the most out of your sponsorship and take advantage of the graphical material at your disposal.

In the digital library, you can find the Summit’s logo, PowerPoint templates, and banners.

Digital Library

 

Media Partners

SEMI is proud to partner with the following media and associations to bring you news about this event. If you are interested in partnering with us, please contact us: Serena Brischetto at sbrischetto@semi.org

3D
Auvergne-Rhône-AlpesCEA-LETICSRCMM International
DSP ValleyEETimesEEnewsElectroniqueSElektronik iNordenEOellettoronica
Markt and TechnikimicronewsMems_200pxMinalogic150Semisrael_200px
Silicon SaxonySensors_MDPISmart systems IntegrationTechnology NetworksVeritas-et-VisusVDMA

We Thank Our Committee Members

Special thanks to our Committee Members for the realization of MEMS & Imaging Sensors Summit!

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