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Sikama International Announces Product Support for Copper and Silver Sintering Applications Used in the Power Electronics and EV Markets |
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Wooptix closes $11 million Series B financing round |
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RoodMicrotec N.V. publishes the Interim Report for 2023 |
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MRSI To Exhibit with Live Demonstrations and Present at LASER World of PHOTONICS CHINA 2023 |
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ATREG Successfully Assists Elmos Semiconductor SE with the Sale of its 200mm Wafer Fab in Dortmund, Germany |
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PHOTODIGM UNVEILS A STRATEGIC PRODUCT RESTRUCTURING PAIRED WITH A 25% PRICE REDUCTION AS CUSTOMER DEMAND CONTINUES TO DRIVE INCREASED PRODUCTION |
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Moov to Unveil New Semiconductor Equipment Marketplace Features at SEMICON West 2023 |
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Brewer Science Earns Intel’s 2023 EPIC Distinguished Supplier Award |
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Important visitor from Japan – from parent company EBARA Corporation Tokyo |
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Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes |
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Xpeedic Releases RF EDA Solution 2023 at IMS |
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Xpeedic Ships Unprecedented Two-Billionth Integrated Passive Device |
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PEER Group sharing expertise during industry-led Global Cybersecurity Forum at SEMICON West 2023 |
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Axiomise Launches Next-Generation formalISA App for RISC-V Processors |
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Busch Vacuum Solutions Exhibiting at SEMICON West 2023 |
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PEER Group joins SEMI Midwest Chapter as a founding member, supports the advancement of the North American semiconductor industry |
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AI LEADER JÜRGEN GROTEPASS BOOSTS DATAPROPHET’S INDUSTRY IMPACT |
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Imec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) |
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PEER Group presenting webinar on the adoption of SEMI Standards for assembly and test processes |
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RoodMicrotec and SGA enter into cooperation for ASIC testing |
