APHI Regional Groups
SEMI APHI Technology Community global reach extends all over the world and enables our members to connect and collaborate on specific issues and challenges affecting different regions. We focus on important key topics and seek to find solutions that will benefit the entire industry.
Explore recent activities and join the working groups, standards committees, event speaker committees and task forces in your region.
If you are interested in joining a regional chapter or task force within a region, please reach out to aphi-tc@semi.org
America's Chapter
Program & Events Committee
Join committee members from the Americas Chapter as they meet to discuss and build the content for all the advanced packaging & heterogeneous integration activities that take place in the Americas. The P&E Committee (PEC) members are directly involved in and responsible for developing, planning, and executing engaging and informative programs and events for APHI.
Education Task Force
The APHI Education Task Force will work with members and the SEMI University and Work Force Development SEMI teams to develop and implement comprehensive educational resources and initiatives addressing the rapidly evolving fields of advanced packaging and heterogeneous integration (HI) in microelectronics and related disciplines.
Roadmaps Task Force
The APHI Roadmaps Task Force focuses on identifying congruency of forward-looking roadmaps for APHI technologies, guiding industry research, development, and investment towards addressing key challenges and unlocking future potential.
Taiwan Chapter
Packaging & Testing Committee
The SEMI Taiwan Testing Committee was formed to meet that need, gathering testing experts and academics from MediaTek, Intel, NXP Semiconductors, TSMC, UMC, ASE Technology, SPIL, KYEC, Teradyne, Advantest, FormFactor, MJC, Synopsys, Cadence, Mentor, and National Tsing Hua University to collaborate in building a complete testing ecosystem. The committee addresses common technical challenges faced by the industry and cultivates next-generation testing professionals to enable Taiwan to maintain its global leadership in semiconductor testing.
The SEMI Taiwan Testing Platform spans communities, expositions, programs, events, networking, business matching, advocacy, and market and technology insights. For more information about the SEMI Taiwan Testing platform, please contact Elaine Lee (elee@semi.org) or Ana Li (ali@semi.org).
Advanced Testing Paradigm Shifting in Era of Heterogeneous Integration | SEMI
Europe Chapter
Advanced Packaging Conference Committee
The Advanced Packaging Conference Committee is responsible for the development of the annual APC, which addresses assembly, interconnection, packaging, and test of electronics. This is one of the most highly participated conferences focused in this area. The committee is also responsible for the call and the peer review of papers addressing the same themes.
Advanced Packaging Conference (APC) Committee | SEMI
3D & Systems Summit Conference Committee
The 3D & Systems Summit Committee engages in shaping the program of the event, which addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.
3D & Systems Summit Committee | SEMI
ESIPAT Executive Committee
The European SEMI integrated Packaging, Assembly, and Testing (ESiPAT) executive committee consists of senior experts from SEMI member companies who have semiconductor packaging, assembly, or test manufacturing and/or design capabilities and capacities. The main goal of this committee is to promote the sustainable development of the Semiconductor Packaging, Assembly, and Test industry in Europe.