The SEMI Standards Program brings together experts to exchange ideas and work towards developing globally accepted technical standards.
Starting from the SECS (SEMI Equipment Communications Standard) and GEM (Generic Model for Communications and Control of Manufacturing Equipment) standards, and more recently with Equipment Data Acquisition standards, the SEMI Standards Program has served as the platform for development of advanced automation standards enabling Smart Manufacturing across the microelectronics industry.
SEMI Smart Manufacturing Standards
- Modern fabs gather constant streams of data from hundreds of sensors, enabling real-time optimization of manufacturing processes to improve yield, mitigate defects, and enhance productivity towards reducing cost and cycle time.
- As features sizes shrink, with more restrictive tolerances the need for greater visibility into the entire manufacturing process has intensified, and specific manufacturing information (e.g. equipment health and performance and process monitoring) must be collected in increasingly greater amounts, and as close to real time than ever before.
Investment in equipment automation and equipment data acquisition is absolutely critical for High Volume Manufacturing (HVM) thought the primary challenges due to automation complexity, time consuming equipment integration, have to be overcome to access data necessary for troubleshooting issues. Early adoption & implementation of Standards in the manufacturing process is much easier than retrofitting afterwards.
Critical SEMI Standards for Productivity
CONNECTIVITY
Communication Protocols
- SEMI E4-0418 — Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
- SEMI E5-0622 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
- SEMI E37-0222 — High-Speed SECS Message Services (HSMS) Generic Services
- SEMI E39-1218 — Object Services Standard: Concepts, Behavior, and Services
Equipment Control
- SEMI E30-0423 — Specification for the Generic Model for Communications & Control of Manufacturing Equipment (GEM)
- SEMI E40-1218 — Standard for Processing Management
- SEMI E84-1109 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
- SEMI E87-0921 — Specification for Carrier Management (CMS)
- SEMI E90-0921 — Specification for Substrate Tracking
- SEMI E94-0314 — Specification for Control Job Management
Metrics
- SEMI 124-1107 Guide for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics
- SEMI E79-0422 Specification for Definition and Measurement of Equipment Productivity
Automation Technology
Automated Test Equipment
- SEMI E183-1121 - Specification for Rich Interactive Test Database (RITdb)
- SEMI A4-0821 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
Surface-Mount Technology Assembly Lines Automation [Smt-Els]
- SEMI A1-0123 Specification for Production Equipment Smart Connection Interface (PESCI)
- SEMI A1.1 —Specification for Media Interface for A Horizontal Communication (HC) Between Equipment
- SEMI A2 —Specification for Surface Mount Assembler Smart Hookup (SMASH)
Automation for Adjacent Industries
- SEMI A3 - Specification for Printed Circuit Board Equipment Communication Interfaces (PCBECI)
- SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
- SEMI PV2 - Guide for PV Equipment Communication Interfaces (PVECI)
Information models – variable/event ID lists, structured equipment metadata, classification labels for instance domains
Equipment Data Acquisition & Process Diagnostics
- SEMI E120-0922 — Specification for the Common Equipment Model (CEM)
- SEMI E125-1022 — Specification for Equipment Self Description (EqSD)
- SEMI E128-0414 — Specification for XML Message Structures
- SEMI E132-0922 — Specification for Equipment Client Authentication and Authorization
- SEMI E134-1022 — Specification for Data Collection Management
- SEMI E138-0217 — Specification for XML Semiconductor Common Components
- SEMI E164-0414 — Specification for EDA Common Metadata
- SEMI E178-0120 — Guide for EDA Freeze Version
- SEMI E179-0822 — Specification for Protocol Buffers Common Components
Traceability
- SEMI T21-0314 Specification for Organization Identification by Digital Certificate Issues from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply Chain
- SEMI T23 -0420 Specification for Single Device Traceability for the Supply Chain
- SEMI T18-1106 Specification of Parts and Components Traceability
- SEMI T6-0697E Procedure and Format for Reporting of Test Results by Electronic Data Interchange (EDI)
Data Security
Cybersecurity
- SEMI E187-0122 - Specification for Cybersecurity of Fab Equipment
- SEMI E188-0222 - Specification for Malware Free Equipment Integration
Factory System Architecture - CIM Framework, Big Data/AI/ML support, AWS-style designs for high scalability/availability
- SEMI E51-0200 Guide for Typical Facilities Services and Termination Matrix
- SEMI F42-0200 – Test Method for Semiconductor Processing Equipment Voltage Sag Immunity
- SEMI F97-0305 Specification for Facility Package Integration, Monitoring and Control
- SEMI E76-0299 Guide for 300mm Process equipment Points of Connection to Facility Services
Predictive Analytics
Advanced Analytics and Process Control
- SEMI E116-0518 — Specification for Equipment Performance Tracking
- SEMI E126-0708 — Specification for Equipment Quality Information Parameters (EQIP)
- SEMI E133-1218 — Specification for Automated Process Control Systems Interface
- SEMI E157-0611 — Specification for Module Process Tracking
Digital Twins – fault/control models and material status for APC, factory snapshots for scheduling/dispatching, frameworks for managing them
Data Integration & Management
- SEMI E151-1211 — Guide for Understanding Data Quality
- SEMI E160-1211 — Specification for Communication of Data Quality
- SEMI E172-0320 — Specification for SECS Equipment Data Dictionary (SEDD)
- SEMI E173-0721 — Specification for XML SECS-II Message Notation (SMN)
Articles & White Papers
- Big Data Transfers with the EDA/Interface A SEMI Standard Suite (Albert Fuchigami, PEER Group Inc. - Dec 2021)
- Traceability and Security Across the Supply Chain – (Dave Huntley - PDF Solutions Inc.)