ISS 2014 Abstract: Mark Thirsk, Linx Consulting
Materials Supply Challenges in the Face of Accelerating Change in the IC Industry
The IC industry will be subject to unprecedented change in the next 3 to 5 years. This paper will review the implications for the materials supply industry stemming from novel device architectures, the introduction of 450 mm wafers, challenges in lithography, the introduction of EUV, and increased packaging complexity with the implementation of TSV and multi-cube packages. The shift in emphasis to vapor deposition precursors, plating, and spin on technologies will be analyzed, as well as the implications for existing technologies used in current devices.
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