2023-09-05
AI, HPC(High Performace Computing) 등 첨단 어플리케이션의 등장으로 인해 반도체의 미세화 및 고성능화가 가속화되면서 이를 구현하는 차세대 패키징 기술에 대한 수요가 높아지고 있습니다. 이러한 산업의 흐름에 발맞춰 SEMI에서는 Advanced Packaging Summit(APS)을 개최합니다. 올해는 고성능 컴퓨팅(HPC) 및 이를 뒷받침할 Interconnection 기술을 주제로 하여 3D 패키징, HIR(Heterogeneous Integration Roadmap), Hybrid Bonding, LAB(Laser Assisted Bonding), 공급망 관리 등에 대해 다룰 예정입니다. 업계 최고 기술 전문가들이 HPC 시스템을 위한 고밀도, 고대역폭 및 저지연 인터커넥트를 지원하는 고급 패키징 솔루션에 대한 경험을 공유할 뿐만 아니라, 각 세션마다 적극적인 정보 교환의 장으로 활용할 수 있는 패널 토의를 통해 상호 소통이 가능한 컨퍼런스가 될 수 있도록 준비하였습니다. 본 컨퍼런스에서 전문가들과의 비즈니스 네트워크와 더불어 기술과 시장에 대한 인사이트를 발견하시기 바랍니다.
시간
9:00 오전 - 5:30 오후
위치
대한민국
수원컨벤션센터
아젠다
Session 1: High-Performance Computing
Hetero Integration, High Performance Computing and AI
Xin Wu received PhD and MSc from University of California Berkeley USA and Peking University, China, respectively. Since 1993, he has worked in Xilinx (acquired by AMD in 2022) from 0.6um till 2nm generations of technologies and products, from many foundries and suppliers. His responsibilities include silicon, hetero-integration, advanced packaging, thermal mechanical solutions and many other technologies development.
PKG Interconnection Technology for HBM
Mr. Moon is currently working as a technical leader (VP) for package technology development, in SK hynix. He has more than 25 years’ experience in semiconductor package development including wafer level, flip chip and 2.5D/ 3D packaging as well as conventional package.
He previously served as package development project manager for package material, process and equipment until assuming his current role in 2022. And he has been involved in the development and mass production of NAND Flash, DRAM/ Mobile, MCP, RDL, Flip chip, WLCSP and TSV.
He received degree in chemistry from Sogang University in Seoul, Korea.
The next wave of Semiconductor Innovation – Multi-die system solution
Donghan Kim is a leader of Strategy Collaboration Solution Development at Synopsys Korea. He is responsible for leading 2.5D and 3D multi-die system solution business aiming to offer a complete end-to-end solution for efficient multi-die system integration.
He has more than 20 years of experience in semiconductor industry and has worked extensively on SOC mobile chip designs such as Exynos series at Samsung Electronics. He had a strong track record of successfully developing modem, WiFi and Bluetooth chipset products.
He received MS degree in electronic engineering from Sogang university in Seoul Korea where he did research topics on wireless communications and Semiconductor.
Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends
Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Intelligence, part of Yole Group. Within the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects.
Prior to Yole, Stefan served as a Package Design Engineer at Teledyne E2V for 4 years, where he was in charge of the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations.
Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).
Break
Panel Discussion
Session 2: Interconnection Technology for HPC
Advanced Heterogeneous Integration
Jongsoo Choi, Ph.D. was appointed as head of marketing strategy part at Business Development Team of AVP Business, Samsung Electronics in December 2022, after completing Advanced PKG Task Force for six months. Before his new role, Dr. Choi was responsible for SoC product marketing as a director at System LSI Business from 2014.
Prior to joining the System LSI, Dr. Choi was Principal Engineer, and has led 4G mobile communication standards project at DMC R&D Center (now Samsung Research) since he joined Samsung Electronics in 2005, where he contributed to the 3rd Generation Partnership Project (3GPP) specifications which cover cellular telecommunications technologies, and also served as a vice chairman of 3GPP TSG GERAN from 2007 to 2011.
Dr. Choi received a Ph.D. degree in Electrical Engineering from the University of Ottawa, Ontario, Canada, where he focused research topics on wireless communications and adaptive signal processing.
Interconnect via scaling and challenges with hybrid bonding
Dr. Vikas Dubey, is a senior scientist at Fraunhofer ENAS since 2021 with system packaging department. He is into advanced system packaging for more than 10 years. He is currently leading the research activities related to hybrid bonding, collective die to wafer bonding and several other wafer bonding technologies for MEMS/NEMS integration. Besides, in his current role he is directly responsible for project acquisition, managing public and industrial projects and related to advance system integration, hybrid wafer bonding and assembly.
Prior to joining Fraunhofer ENAS he worked as a technology manager at national nanofabrication center (NNFC) at Indian Institute of Sciences, Bangalore. During his time at APTIV services located in hungary, he was responsible for several six sigma projects which lead to million of euros in earnings.
Dr. Dubey received his PhD degree from materials engineering department from KU Leuven, where he worked at imec with his research focused on self-aligned assembly for fine pitch integration.
Novel Materials for Advanced Packaging
Dongshun Bai, Ph.D. has been with Brewer Science, Inc. since 2007. Dongshun works as the Senior Technologist & Business Development Director in the Packaging Solutions Business Unit, in charge of technology roadmap direction of new material development for advanced packaging. He also leads the Business Development team and oversees the global business activities for advanced packaging materials.
Dongshun spent his first 10 years at Brewer Science in its Advanced Technologies R&D group. Working as Senior Program Manager and Senior Scientist, he led an R&D team focused on material design and development for advanced packaging. Many materials developed by his team went to commercialization and became the major products in the portfolio.
Dongshun earned a Ph.D. degree in Chemical Engineering from Vanderbilt University, Nashville, TN, USA and a Master of Engineering degree in Chemical Engineering from the National University of Singapore. Dongshun has published numerous papers and patents and delivered many talks, including invited talks at international conferences. He currently serves as a technical committee member for IMAPS and EPTC.
Laser Assisted Bond (LAB) Technology Overview
SeokHo Na joined Amkor Technology Korea in 1996 and worked for R&D engineer until now with responsibility of semiconductor material & process development. Major work is chip to substrate interconnection technology development such as wire bonding, Material Characterization, Flip Chip package CIP (chip to package interaction) and LAB (Laser Assisted Bonding) technology.
Prior to joining Amkor Technology Korea, Na received a bachelor’s degree and master’s’ degree in Material Science & Technology from Yeungnam University, Korea
Break
Panel Discussion
등록안내
사전등록 마감일: 2023년 8월 29일(화) 오후 5시
등록비용
- 사전등록 (8월 29일 화요일까지)
가격 | SEMI 회원사 | 비회원사 |
1개 세션 | 12만원 | 15만원 |
2개 세션 | 20만원 | 24만원 |
- 현장등록
가격 | SEMI 회원사 | 비회원사 |
1개 세션 | 15만원 | 18만원 |
2개 세션 | 24만원 | 29만원 |