June 12, 2024 - June 14, 2024
Smarter Systems through Heterogeneous Integration
3:00 pm - 12:30 pm
Hilton Dresden Hotel
An der Frauenkirche 5 D
Thank you to all the participants who took part in the 3D & Systems Summit 2023. Save the date for the 2024 event, which will take place on June 12-14 in Dresden, Germany. Please review the 2023 event agenda below. The 2024 information will be available at a later stage.
DISTINGUISHED SPEAKERS 2023
The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore's Law plateauing. Therefore, continued developments and innovation are essential to growing the business.
Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies.
Several B2B matching opportunities await during the conference, including networking reception, coffee breaks, lunches, and a unique Networking Dinner Cruise at the beautiful Elbe River.
DAY 1 | Monday, June 26
Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Transition of KDT towards Chips JU
The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing. Applications such as autonomous driving, 6G, the internet of things (IoT), artificial intelligence, machine learning, etc. have had tremendous growth and brought new opportunities for innovation. This session will focus on the industry trends and market drivers that affect the industry moving forwards.
Chiplet Design and 2.5D Integration: Evolution or Revolution
Let’s Disrupt Automotive Electronics – New Opportunities Driven by Heterogeneous Integration
Addressing Your Talent Gap Through Diversity, Equity, Inclusion, and Belonging (DEIB)
3D Applications and Challenges
Panel Discussion: Customer-Supplier Partnering to Overcome Challenges in 3D
Moderator: Jan Vardaman, President, TechSearch International, Inc.
Hilton Dresden Hotel
An der Frauenkirche 5 D
DAY 2 | Tuesday, June 27
Over the last few decades, 3D technologies have always provided promise for future applications. We are now delivering on this promise. As the 3D ecosystem has tackled many of the key difficulties we are now seeing high-volume applications with increasing 3D technology content. This momentum is driving 3D technologies into the front-end processes to enable increasing integration densities at excellent yields. This session will discuss the progress and collaborations across the 3D ecosystem towards increasing contribution to sustaining the pace of Moore’s law.
The Growth of Heterogeneous Integration and Evolution of 3D Packaging
System Performance Scaling: Today’s High Volume Applications and Next Generation Requirements
The Future of Advanced Packaging Inspection is X-ray!
Continued performance scaling is not only driven by classical device scaling, however 3D integration in various flavors plays a key role in meeting future performance gains. Agreement prevails on the intersection of 10µm pitch from solder based interconnects to solid-state hybrid bond interfaces. Besides wafer-to-wafer also die-to-wafer hybrid bonding is determining future system design and manufacturing flows. In this section, we discuss all relevant aspects of hybrid bonding from central preparation processes and materials to actual bonding equipment.
Recent Advances in Direct Hybrid Bonding
PECVD Dielectrics for Inter-die Gap Fill and High Sensitivity Inspection Needs for D2W Hybrid Bonding
Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration
Materials Engineering Innovations for Hybrid Bonding
An insight into Chip to Wafer Hybrid Bonding
Nowadays, addressing the challenges and opportunities arising from heterogeneous integration requires dealing with all the aspects related to their design: from the architecture and programming models to hardware/software integration and orchestration to real-time and security requests. This session will address modern heterogeneous systems and their evolution.
MOSAICS-LP: A Scalable Chiplet Platform
Aligning Process Technology, Design, and Architecture for Heterogeneous Integration
A Chiplet Reference Platform Utilizing OCP Bunch-of-Wires
Current Chiplet Design, Simulation and Modelling at Racyics
Enabling a Chiplet Ecosystem: Standardization of Heterogenous Integrated Chiplet Models
Advanced Packaging for Heterogeneous Integration
The exponentially growing data traffic is becoming a serious concern and will soon account for over 10% of global electricity consumption. The rescue could be found in Photonics – the technology that uses light to carry information. Integrating photonics on the chip level will provide low-energy, high-speed data transmission throughout the internet, as well as within data centers. Photonics also enables sensing and vision applications in healthcare, autonomous driving, and smart farming. However, the increasingly complex photonic chips must be produced at a much lower cost to live up to these expectations.
Photonics Systems for High Performance
Overview on Imec’s Photonics Technology Platforms
State of the Art and Novel Wafer Level Solder Bumping Techniques for Heterogenous Integration to Build Smart and Smarter Systems
The Networking Dinner will take place on a cruise at the Elbe River and will include Welcome Remarks by the Mayor of Dresden Dirk Hilbert.
The cruise is located within walking distance of the Hilton Dresden Hotel.
Dress code: Business Smart
The exact cruise location will be available soon.
DAY 3 | Wednesday, June 28
Solder bump interconnects are still the main method to vertically transport signals from device to device in today's advanced 3D packaging. Hybrid bonding enjoys distinct advantages here at ultra-high densities or rather enables them in the first place, and is thus catching up with the increasing number of high-performance applications. Nevertheless, both today and in the future, there is still a need for alternative and new approaches to interconnects, which will be highlighted in this session. In addition to electrical interconnects, other physical interface concepts such as optical or microfluidic interfaces that allow for higher-order overall 3D systems are also of interest. As the session title already suggests, besides interconnect technologies, innovative process approaches for 3D integration at the package and chip level will also be offered a platform here.
High Precision Die-to-Wafer Hybrid Bonding: Key Factors for Success
Putting Light Into Your Chips: Heterogeneous Integration of InP Photonics
Nanocleave – Enabling Next Generation 3D Integration
Roadmap on Wet Processing for Advanced PLP Technology
Micro-bump Technology Overview for 3D Heterogeneous Integration
Thin Film Technology for Heat Dissipation Layers in High Performance Computing Applications
Heterointegration: A Solution for Environmentally Friendly System Integration?
Conference Reflections of 3D & Systems Summit Committee
End of Conference
- SEMI Members: 950 EUR
- Non-members: 1,250 EUR
* VAT excl.
**Tickets for the Networking Dinner Cruise are sold separately, if you want to register for it, click here.
- Access to all 3D & Systems Summit sessions
- Access to the exhibition area
- All conference proceedings
- Coffee breaks and lunches are mentioned in the agenda section of the conference website
- Networking reception on Conference Day 1, Monday, June 26, 2023
- Conference ticket:
- A 25% cancellation fee applies until April 30, 2023.
- No refund possible after May 1, 2023.
- The Networking Dinner Cruise ticket is non-refundable.
The Networking Dinner Cruise will take place on Tuesday, June 27 (Day 2 of the Conference) at the Elbe River.
Price for the Networking Dinner Cruise:
- Summit Attendee Ticket: 129 EUR
- Spouse Ticket: 149 EUR
* VAT excl.
**Networking Dinner registration is only for 3D & Systems Summit 2023 participants.
Registration is available here.
If you are interested in purchasing a ticket for your spouse, please contact email@example.com.
- SEMI member: 3,450 EUR*
- Non-SEMI member: 3,850 EUR*
* VAT excl.
Exhibition fee includes:
- 1 booth
- 1 free entry ticket
- 1 discounted entry ticket
Booths have a structure of 2.5m height with back walls of 2m wide and sidewall of 1m wide. The depth of the booth is 2m.
Modular booth includes:
- Booth space (2m x 2m)
- 1 signboard with exhibitor name (up to 25 letters)
- 1 table (80 x 80 x 72cm)
- 2 chairs
- 1 paper bin
- 1 set spotlight LEDs 40W
- 1 triple extension socket
Exhibitors on corner positions may request in advance that the sidewall be removed.
An der Frauenkirche, 5
Tel. 0049 (0)351 86420
Booking link for Hilton Dresden: click here
- Room rate starts at 149 EUR per night
- Booked rooms are cancellable free of charge till 7 days prior to arrival
- For booking a room a guarantee by credit card is mandatory
- The offered room rate is including our Hilton Breakfast buffet, service charge, and VAT
For further hotel booking options: click here
Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships.
Contact: Adi Hodorov at firstname.lastname@example.org
Are You Already a Sponsor?
Make the most out of your sponsorship and take advantage of the graphical material at your disposal.
In the digital library, you can find the Summit’s logo, PowerPoint templates, and banners.
SEMI is proud to partner with the following media and associations to bring you news about this event. If you are interested in partnering with us, please contact Serena Brischetto at email@example.com
We Thank Our Committee Members
Special thanks to our Committee Members for the realization of 3D & Systems Summit!