Heterogeneous Systems for the Intelligently Connected Era

The first session will analyze the dynamic relationship between global semiconductor trends and the European landscape. The semiconductor industry's constant evolution and influence on the regions where strategic investments have been made, highlight significant implications for technological progress and economic expansion. This session will discuss how the semiconductor market has experienced remarkable growth fueled by escalating demand for advanced electronic devices and emerging technologies.

This session will explore the dynamic chiplet designs, spotlighting emerging trends, challenges, and the impact of the packaging within the semiconductor manufacturing process. Industry experts will highlight innovative design approaches, optimization strategies, and packaging solutions that propel the progression of chiplet technologies.

Insights into the latest advancements in hybrid bonding technologies, a cutting-edge approach facilitating advanced 3D integration in the semiconductor industry, will be presented throughout this session. Speakers will explore recent developments, novel techniques, and emerging applications, with a great focus on the transformative potential of hybrid bonding for enhancing chip performance, efficiency, and functionality.

This session will navigate the complexities of manufacturing processes involved in 3D integration, focusing on key challenges. Industry experts will examine innovative approaches and technological advancements aimed at streamlining manufacturing workflows and achieving higher performance, reliability standards, and optimization across various stages of the manufacturing pipeline.

This session explores the potential of Co-Packaged Optics (CPO) as the evolution of integrated photonics, focusing on the pressing demand for extreme bandwidth and sophisticated data processing and high-bandwidth computing. By spotlighting innovations like silicon photonics bridges, the discussion emphasizes how CPO technology not only offers cost-effective solutions but also enhances the integration with existing network architectures. This integration is key to unlocking improved performance, scalability, and reliability in data transmission and processing systems. Attendees will learn about the strategic importance of CPO in advancing integrated photonics, enabling a seamless transition toward more efficient and robust optical systems.

The semiconductor industry recognizes the importance of environmental sustainability and is actively exploring alternatives to conventional materials that are more environmentally friendly and sustainable. This session will focus on collaboration, innovation, and ongoing commitment from semiconductor companies striving to minimize their environmental footprint and contribute to a more sustainable future.