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June 26, 2023 - June 28, 2023

3D logo

#3DSummit

Smarter Systems through Heterogeneous Integration

Time

3:00 pm - 12:30 pm

Add to Calendar 2023-06-26 15:00:00 2023-06-28 12:30:00 3D & Systems Summit #3DSummit Smarter Systems through Heterogeneous Integration Dresden Hilton Hotel An der Frauenkirche 5 D 01067 Dresden Alemania SEMI.org contact@semi.org America/Los_Angeles public
Location

Dresden Hilton Hotel
An der Frauenkirche 5 D
01067 Dresden
Germany

3D logo

DISTINGUISHED SPEAKERS

 

Distinguished Speakers

 

 

SPONSORS

3D Sponsors

 

The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore's Law plateauing. Therefore, continued developments and innovation are essential to growing the business.

Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies. 

Several B2B matching opportunities await during the conference, including networking reception, coffee breaks, lunches, and a unique Networking Dinner Cruise at the beautiful Elbe River

Agenda

DAY 1 | Monday, June 26

Opening Session

3:00 pm - 3:20 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Welcome Remarks

3:20 pm - 3:40 pm

Reserved

3:40 pm - 4:00 pm
Raja Swaminathan
Raja Swaminathan
Corporate Vice President
AMD

Advanced Packaging: Enabling Moore’s Law’s Next Frontier

The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing. Applications such as autonomous driving, 6G, the internet of things (IoT), artificial intelligence, machine learning, etc. have had tremendous growth and brought new opportunities for innovation. This session will focus on the industry trends and market drivers that affect the industry moving forwards.

4:00 pm - 4:10 pm
Chris Jones
Chris Jones
Senior Director, PVD Product Management
SPTS Technologies Ltd, a KLA company

Opening Remarks by Session Chair

4:10 pm - 4:30 pm
Emilie Jolivet
Emilie Jolivet
Semiconductor, Memory and Computing Division Director
Yole Group

Topic Coming Soon

4:30 pm - 4:50 pm

Reserved

4:50 pm - 5:10 pm

Reserved

5:10 pm - 5:55 pm
Jan Vardaman
Moderator
Jan Vardaman
President
TechSearch International, Inc

Panel Discussion: How Does the Supply Chain Challenges Restructured Translate the Customer-Supplier Relationships?

5:55 pm - 6:00 pm
Chris Jones
Chris Jones
Senior Director, PVD Product Management
SPTS Technologies Ltd, a KLA company

Key Takeaways by Session Chair

6:00 pm - 8:30 pm

Location:
Dresden Hilton Hotel
An der Frauenkirche 5 D
01067 Dresden
Germany

DAY 2 | Tuesday, June 27

Over the last few decades, 3D technologies have always provided promise for future applications. We are now delivering on this promise. As the 3D ecosystem has tackled many of the key difficulties we are now seeing high-volume applications with increasing 3D technology content. This momentum is driving 3D technologies into the front-end processes to enable increasing integration densities at excellent yields. This session will discuss the progress and collaborations across the 3D ecosystem towards increasing contribution to sustaining the pace of Moore’s law.

9:00 am - 9:10 am
Laith Altimime
Laith Altimime
President
SEMI Europe

Welcome Remarks

9:10 am - 9:15 am
Steven Steen
Steven Steen
Head of Product Management, Process Window Control Applications
ASML

Opening Remarks by Session Chair

9:15 am - 9:35 am
Rozalia Beica
Rozalia Beica
VP Strategic Marketing & Business Development, Microelectronics Business Unit
AT&S China

Topic Coming Soon

9:35 am - 9:55 am
Moyra McManus
Moyra McManus
Director, Category Manager Light Sources, Strategic Sourcing
ASML

Topic Coming Soon

9:55 am - 10:15 am

Reserved

10:15 am - 10:20 am
Steven Steen
Steven Steen
Head of Product Management, Process Window Control Applications
ASML

Key Takeaways by Session Chair

10:20 am - 11:05 am

Coffee Break

Continued performance scaling is not only driven by classical device scaling, however 3D integration in various flavors plays a key role in meeting future performance gains. Agreement prevails on the intersection of 10µm pitch from solder based interconnects to solid-state hybrid bond interfaces. Besides wafer-to-wafer also die-to-wafer hybrid bonding is determining future system design and manufacturing flows. In this section, we discuss all relevant aspects of hybrid bonding from central preparation processes and materials to actual bonding equipment.

11:05 am - 11:10 am
Thomas Uhrmann
Thomas Uhrmann
Director of Business Development
EV Group

Opening Remarks by Session Chair

11:10 am - 11:30 am

Reserved

11:30 am - 11:50 am
Keith Buchanan
Keith Buchanan
Senior Product Manager, PECVD
KLA Corporation (SPTS Division)

PECVD Dielectrics for Inter-Die Gap Fill in Hybrid Bonding Applications

11:50 am - 12:10 pm
Jonathan Abdilla
Jonathan Abdilla
Product Manager Hybrid Bonding
Besi

An insight into Chip to Wafer Hybrid Bonding

12:10 pm - 12:30 pm
Ralf Schmidt
Ralf Schmidt
R&D Manager Semiconductor
MKS-Atotech

Topic Coming Soon

12:30 pm - 12:50 pm
Emmanuel Ollier
Emmanuel Ollier
Head of the Laboratory of 3D Integration Technologies
Cea-Leti

Recent Advances in Direct Hybrid Bonding

12:50 pm - 12:55 pm
Thomas Uhrmann
Thomas Uhrmann
Director of Business Development
EV Group

Key Takeaways by Session Chair

12:55 pm - 1:55 pm

Networking Lunch

Nowadays, addressing the challenges and opportunities arising from heterogeneous integration requires dealing with all the aspects related to their design: from the architecture and programming models to hardware/software integration and orchestration to real-time and security requests. This session will address modern heterogeneous systems and their evolution.

1:55 pm - 2:00 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Opening Remarks by Session Chair

2:00 pm - 2:20 pm
Anthony Philippe
Anthony Philippe
Research Engineer
CEA-Leti

MOSAICS-LP: A Scalable Chiplet Platform

Yoan Dupret
Yoan Dupret
Managing Director and CTO
Menta
2:20 pm - 2:40 pm
Seung Kang
Seung Kang
Vice President of Strategy
Adeia, Inc.

Topic Coming Soon

2:40 pm - 3:00 pm
Andy Heinig
Andy Heinig
Head of Department Efficient Electronics
Fraunhofer IIS-EAS

3D Integration and Design

3:00 pm - 3:20 pm

Reserved

3:20 pm - 3:40 pm
Heiko Dudek
Heiko Dudek
Business Development
Siemens EDA

Enabling a Chiplet Ecosystem: Standardization of Heterogenous Integrated Chiplet Models

3:40 pm - 3:45 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Key Takeaways by Session Chair

3:45 pm - 4:30 pm

Coffee Break

Solder bump interconnects are still the main method to vertically transport signals from device to device in today's advanced 3D packaging. Hybrid bonding enjoys distinct advantages here at ultra-high densities or rather enables them in the first place, and is thus catching up with the increasing number of high-performance applications. Nevertheless, both today and in the future, there is still a need for alternative and new approaches to interconnects, which will be highlighted in this session. In addition to electrical interconnects, other physical interface concepts such as optical or microfluidic interfaces that allow for higher-order overall 3D systems are also of interest. As the session title already suggests, besides interconnect technologies, innovative process approaches for 3D integration at the package and chip level will also be offered a platform here.

4:30 pm - 4:35 pm
Thomas Schmidt
Thomas Schmidt
Product Manager Bonder
SÜSS MicroTec

Opening Remarks by Session Chair

4:35 pm - 4:55 pm
Markus Wimplinger
Markus Wimplinger
Corporate Technology Development and IP Director
EV Group

Nanocleave – Enabling Next Generation 3D Integration

4:55 pm - 5:15 pm
Anne Jourdain
Anne Jourdain
Principal Member of Technical Staff, Team Lead 3D Heterogeneous Integration
imec

Micro-bump Technology Overview for 3D Heterogeneous Integration

5:15 pm - 5:35 pm
Pascal Metzger
Pascal Metzger
CEO
SET Corporation S.A.

Topic Coming Soon

5:35 pm - 5:55 pm

Reserved

5:55 pm - 6:00 pm
Thomas Schmidt
Thomas Schmidt
Product Manager Bonder
SÜSS MicroTec

Key Takeaways by Session Chair

The exponentially growing data traffic is becoming a serious concern and will soon account for over 10% of global electricity consumption. The rescue could be found in Photonics – the technology that uses light to carry information. Integrating photonics on the chip level will provide low-energy, high-speed data transmission throughout the internet, as well as within data centers. Photonics also enables sensing and vision applications in healthcare, autonomous driving, and smart farming. However, the increasingly complex photonic chips must be produced at a much lower cost to live up to these expectations.

6:00 pm - 6:05 pm
Ivan Nikitski
Ivan Nikitski
Technology Manager
EPIC

Opening Remarks by Session Chair

6:05 pm - 6:25 pm

Reserved

6:25 pm - 6:45 pm
Natarajan Rajasekaran
Natarajan Rajasekaran
R&D Engineer
imec

Topic Coming Soon

6:45 pm - 7:05 pm

Reserved

7:05 pm - 7:10 pm
Ivan Nikitski
Ivan Nikitski
Technology Manager
EPIC

Key Takeaways by Session Chair

7:30 pm - 11:00 pm

The Networking Dinner will take place on a cruise at the Elbe River.

The cruise is located within walking distance of the Dresden Hilton Hotel. Boarding of the cruise will start at 7:30 pm and it will leave shore at 8:00 pm.

Dress code:
Business Smart

The exact cruise location will be available soon.

DAY 3 | Wednesday, June 28

Sustainability and the associated integration of environmental and social aspects into the industry are of crucial importance to ensure livable conditions for current and future generations. This session will focus on how the semiconductor industry, technology, and digitalization can be used to reduce greenhouse gas emissions, and waste generation, and to improve waste disposal, water, and materials recycling, as well as social impacts. In this context, alignment with upcoming regulations, proper goal setting, and assessment of the achievements will affect our industry as it progresses.

9:00 am - 9:10 am
Ralf Schmidt
Ralf Schmidt
R&D Manager Semiconductor
MKS-Atotech

Opening Remarks by Session Chair

9:10 am - 9:30 am
Michael Töpper
Michael Töpper
Senior Specialist
Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics

Heterointegration: A Solution for Environmentally Friendly System Integration?

9:30 am - 9:50 am

Reserved

9:50 am - 10:10 am

Reserved

10:10 am - 10:20 am
Ralf Schmidt
Ralf Schmidt
R&D Manager Semiconductor
MKS-Atotech

Key Takeaways by Session Chair

10:20 am - 11:05 am

Coffee Break

In recent years, significant progress was realized for materials, processes, and equipment to support 3D assemblies for scaling well-established interconnect technologies like flip chips as well as to improve the manufacturing maturity of newer technologies like hybrid bonding or optical interconnects. This extends the implementation of 3D integration in a wider range of products. This session demonstrates examples of how 3D technologies enable new applications.

11:05 am - 11:15 am
Manuela Junghaehnel
Manuela Junghaehnel
Head of Department Wafer Level System Integration
Fraunhofer IZM –ASSID

Opening Remarks by Session Chair

11:15 am - 11:35 am
Wilfred Gomes
Wilfred Gomes
Intel Fellow, Microprocessor Design and Technologies
Intel Corporation

The Next Generation of 3D Products from Mobile to Data Center

11:35 am - 11:55 am
Luc Augustin
Luc Augustin
CTO
Smart Photonics

Topic Coming Soon

11:55 am - 12:15 pm

Reserved

12:15 pm - 12:20 pm
Manuela Junghaehnel
Manuela Junghaehnel
Head of Department Wafer Level System Integration
Fraunhofer IZM –ASSID

Key Takeaways by Session Chair

12:20 pm - 12:25 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Conference Reflections of 3D & Systems Summit Committee

12:25 pm - 12:30 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

12:30 pm

End of Conference

REGISTRATION

Dresden Networking Dinner

Conference price:

  • SEMI Members: 950 EUR
  • Non-members: 1,250 EUR 

* VAT excl.

**Tickets for the Networking Dinner Cruise are sold separately, if you want to register for it, click here

Registration includes:

  • Access to all 3D & Systems Summit sessions
  • Access to the exhibition area
  • All conference proceedings
  • Coffee breaks and lunches are mentioned in the agenda section of the conference website
  • Networking reception on Conference Day 1, Monday, June 26, 2023

Cancellation Policy:

  • Conference ticket:
    • A 25% cancellation fee applies until April 30, 2023.
    • No refund possible after May 1, 2023.
  • The Networking Dinner Cruise ticket is non-refundable. 

The Networking Dinner Cruise will take place on Tuesday, June 27 (Day 2 of the Conference) at the Elbe River.

Price for the Networking Dinner Cruise:

  • Summit Attendee Ticket: 129 EUR
  • Spouse Ticket: 149 EUR

* VAT excl.

**Networking Dinner registration is only for 3D & Systems Summit 2023 participants. 

Registration is available here

If you are interested in purchasing a ticket for your spouse, please contact euevents@semi.org

+
Dresden Networking Dinner

Exhibition

Exhibition 2023 Book a booth now

3D & Systems Summit 2023 Europe Floorplan

 

Booth price

  • SEMI member: 3,450 EUR*
  • Non-SEMI member: 3,850 EUR*

* VAT excl.

Exhibition fee includes:

  • 1 booth
  • 1 free entry ticket 
  • 1 discounted entry ticket 

Booths have a structure of 2.5m height with back walls of 2m wide and sidewall of 1m wide. The depth of the booth is 2m.


Modular booth includes:

  • Booth space (2m x 2m)
  • 1 signboard with exhibitor name (up to 25 letters)
  • 1 table (80 x 80 x 72cm)
  • 2 chairs 
  • 1 paper bin
  • 1 set spotlight LEDs 40W
  • 1 triple extension socket

Exhibitors on corner positions may request in advance that the sidewall be removed.


Contact: euevents@semi.org

CONFERENCE

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Dresden Hilton Hotel

An der Frauenkirche, 5
D-01067 Dresden
Germany
Tel. 0049 (0)351 86420

ACCOMMODATION

Booking link for Hilton Dresden: click here

  • Room rate starts at 129 EUR per night
  • Booked rooms are cancellable free of charge till 7 days prior to arrival
  • For booking a room a guarantee by credit card is mandatory
  • The offered room rate is including our Hilton Breakfast buffet, service charge, and VAT

For further hotel booking options: click here

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Sponsors

Platinum

Gold

Silver

Event

Sponsorship Opportunities

Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships. 

Contact: Adi Hodorov at ahodorov@semi.org

 

Sponsorship Package  Sponsorship Agreement  Post Show Report 2022

 

 

Are You Already a Sponsor?

Make the most out of your sponsorship and take advantage of the graphical material at your disposal.

In the digital library, you can find the Summit’s logo, PowerPoint templates, and banners.

 

Digital Library

 

 

Media Partners

 SEMI is proud to partner with the following media and associations to bring you news about this event. If you are interested in partnering with us, please contact Serena Brischetto at sbrischetto@semi.org

3D InCities
 
CSR Clean room future Date
 
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OES Semiconductor-Packaging-News Silicon Saxony Smart_system_200px    

We Thank Our Committee Members

Special thanks to our Committee Members for the realization of 3D & Systems Summit!