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June 12, 2024 - June 14, 2024

3D logo

#3DSummit

Smarter Systems through Heterogeneous Integration

Time

3:00 pm - 12:30 pm

Add to Calendar 2024-06-12 15:00:00 2024-06-14 12:30:00 3D & Systems Summit #3DSummit Smarter Systems through Heterogeneous Integration Hilton Dresden Hotel An der Frauenkirche 5 D 01067 Dresden Alemania SEMI.org contact@semi.org America/Los_Angeles public
Location

Hilton Dresden Hotel
An der Frauenkirche 5 D
01067 Dresden
Germany

3D logo

Thank you to all the participants who took part in the 3D & Systems Summit 2023. Save the date for the 2024 event, which will take place on June 12-14 in Dresden, Germany. Please review the 2023 event agenda below. The 2024 information will be available at a later stage.

 

DISTINGUISHED SPEAKERS 2023

 

Distinguished Speakers

 

 

SPONSORS 2023

Sponsors

 

The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore's Law plateauing. Therefore, continued developments and innovation are essential to growing the business.

Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies. 

Several B2B matching opportunities await during the conference, including networking reception, coffee breaks, lunches, and a unique Networking Dinner Cruise at the beautiful Elbe River

Agenda

DAY 1 | Monday, June 26

Opening Session

3:00 pm - 3:20 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Welcome Remarks

3:20 pm - 3:40 pm
Raja Swaminathan
Raja Swaminathan
Corporate Vice President
AMD

Advanced Packaging: Enabling Moore’s Law’s Next Frontier

3:40 pm - 3:55 pm
Eric Fribourg-Blanc
Eric Fribourg-Blanc
Program Officer
European Commission

Transition of KDT towards Chips JU

The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing. Applications such as autonomous driving, 6G, the internet of things (IoT), artificial intelligence, machine learning, etc. have had tremendous growth and brought new opportunities for innovation. This session will focus on the industry trends and market drivers that affect the industry moving forwards.

3:55 pm - 4:00 pm
Chris Jones
Chris Jones
Senior Director, PVD Product Management
SPTS Technologies Ltd, a KLA company

Opening Remarks by Session Chair

4:00 pm - 4:20 pm
Emilie Jolivet
Emilie Jolivet
Director of the Semiconductor, Memory & Computing Division
Yole Group

Chiplet Design and 2.5D Integration: Evolution or Revolution

4:20 pm - 4:40 pm
Andre Blum
André Blum
Project Manager, Progressive Semiconductor Program
Audi AG

Let’s Disrupt Automotive Electronics – New Opportunities Driven by Heterogeneous Integration

4:40 pm - 4:55 pm
Michelle Williams
Michelle Williams-Vaden
Deputy Director
SEMI Foundation

Addressing Your Talent Gap Through Diversity, Equity, Inclusion, and Belonging (DEIB)

4:55 pm - 5:25 pm

Coffee Break

5:25 pm - 5:45 pm
Jan Vardaman
Jan Vardaman
President
TechSearch International, Inc

3D Applications and Challenges

5:45 pm - 6:45 pm

Panel Discussion: Customer-Supplier Partnering to Overcome Challenges in 3D

Moderator: Jan Vardaman, President, TechSearch International, Inc.

Raja Swaminathan
Raja Swaminathan
Corporate Vice President
AMD

Panelist

Andre Blum
André Blum
Project Manager, Progressive Semiconductor Program
Audi AG

Panelist

Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Panelist

6:45 pm - 6:50 pm
Chris Jones
Chris Jones
Senior Director, PVD Product Management
SPTS Technologies Ltd, a KLA company

Key Takeaways by Session Chair

6:50 pm - 7:00 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

7:00 pm - 9:00 pm

Location:
Hilton Dresden Hotel
An der Frauenkirche 5 D
01067 Dresden
Germany

DAY 2 | Tuesday, June 27

Over the last few decades, 3D technologies have always provided promise for future applications. We are now delivering on this promise. As the 3D ecosystem has tackled many of the key difficulties we are now seeing high-volume applications with increasing 3D technology content. This momentum is driving 3D technologies into the front-end processes to enable increasing integration densities at excellent yields. This session will discuss the progress and collaborations across the 3D ecosystem towards increasing contribution to sustaining the pace of Moore’s law.

9:00 am - 9:05 am
Steven Steen
Steven Steen
Head of Product Management, Process Window Control Applications
ASML

Opening Remarks by Session Chair

9:05 am - 9:25 am
Rozalia Beica
Rozalia Beica
VP Strategic Marketing & Business Development, Microelectronics Business Unit
AT&S China

The Growth of Heterogeneous Integration and Evolution of 3D Packaging

9:25 am - 9:45 am
Moyra Mc Manus
Moyra Mc Manus
Director, Source and Procure
ASML

System Performance Scaling: Today’s High Volume Applications and Next Generation Requirements

Sheng Wang
Sheng Wang
Strategic Business Development Manager
ASML
9:45 am - 10:05 am
Isabella Drolz
Isabella Drolz
VP Product Marketing
Comet Yxlon

The Future of Advanced Packaging Inspection is X-ray!

10:05 am - 10:10 am
Steven Steen
Steven Steen
Head of Product Management, Process Window Control Applications
ASML

Key Takeaways by Session Chair

10:10 am - 10:55 am

Coffee Break

Continued performance scaling is not only driven by classical device scaling, however 3D integration in various flavors plays a key role in meeting future performance gains. Agreement prevails on the intersection of 10µm pitch from solder based interconnects to solid-state hybrid bond interfaces. Besides wafer-to-wafer also die-to-wafer hybrid bonding is determining future system design and manufacturing flows. In this section, we discuss all relevant aspects of hybrid bonding from central preparation processes and materials to actual bonding equipment.

10:55 am - 11:00 am
Thomas Uhrmann
Thomas Uhrmann
Director of Business Development
EV Group

Opening Remarks by Session Chair

11:00 am - 11:20 am
Emmanuel Ollier
Emmanuel Ollier
Head of the Laboratory of 3D Integration Technologies
CEA-Leti

Recent Advances in Direct Hybrid Bonding

11:20 am - 11:50 am
Keith Buchanan
Keith Buchanan
Senior Product Manager, PECVD
KLA Corporation (SPTS Division)

PECVD Dielectrics for Inter-die Gap Fill and High Sensitivity Inspection Needs for D2W Hybrid Bonding

Wing-Shan Ribi Leung
Wing-Shan Ribi Leung
Senior Manager of Operations and Applications
KLA Corporation (LS-SWIFT Division)
11:50 am - 12:10 pm
Ralf Schmidt
Ralf Schmidt
R&D Manager Semiconductor
MKS-Atotech

Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration

12:10 pm - 12:30 pm
Giorgio Cellere
Giorgio Cellere
Product Management, Advanced Packaging
Applied Materials

Materials Engineering Innovations for Hybrid Bonding

12:30 pm - 12:50 pm
Jonathan Abdilla
Jonathan Abdilla
Director Technical Marketing
Besi

An insight into Chip to Wafer Hybrid Bonding

12:50 pm - 12:55 pm
Thomas Uhrmann
Thomas Uhrmann
Director of Business Development
EV Group

Key Takeaways by Session Chair

12:55 pm - 1:55 pm

Networking Lunch

Nowadays, addressing the challenges and opportunities arising from heterogeneous integration requires dealing with all the aspects related to their design: from the architecture and programming models to hardware/software integration and orchestration to real-time and security requests. This session will address modern heterogeneous systems and their evolution.

1:55 pm - 2:00 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Opening Remarks by Session Chair

2:00 pm - 2:20 pm
Anthony Philippe
Anthony Philippe
Research Engineer
CEA-Leti

MOSAICS-LP: A Scalable Chiplet Platform

Yoan Dupret
Yoan Dupret
Managing Director and CTO
Menta
2:20 pm - 2:40 pm
Seung Kang
Seung Kang
Vice President of Strategy
Adeia, Inc.

Aligning Process Technology, Design, and Architecture for Heterogeneous Integration

2:40 pm - 3:00 pm
Sneha Kadam
Sneha Kadam
Research Assistant
Fraunhofer IIS-EAS

A Chiplet Reference Platform Utilizing OCP Bunch-of-Wires

3:00 pm - 3:10 pm
Michael Dittrich
Michael Dittrich
Team Lead for IC Packaging
Racyics GmbH

Current Chiplet Design, Simulation and Modelling at Racyics

3:10 pm - 3:30 pm
Heiko Dudek
Heiko Dudek
Business Development
Siemens EDA

Enabling a Chiplet Ecosystem: Standardization of Heterogenous Integrated Chiplet Models

3:30 pm - 3:50 pm
vikas ase
Vikas Gupta
Director, Engineering & Technical Marketing
ASE, Inc.

Advanced Packaging for Heterogeneous Integration

3:50 pm - 3:55 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Key Takeaways by Session Chair

3:55 pm - 4:40 pm

Coffee Break

The exponentially growing data traffic is becoming a serious concern and will soon account for over 10% of global electricity consumption. The rescue could be found in Photonics – the technology that uses light to carry information. Integrating photonics on the chip level will provide low-energy, high-speed data transmission throughout the internet, as well as within data centers. Photonics also enables sensing and vision applications in healthcare, autonomous driving, and smart farming. However, the increasingly complex photonic chips must be produced at a much lower cost to live up to these expectations.

4:40 pm - 4:45 pm
Ivan Nikitski
Ivan Nikitski
Technology Manager
EPIC

Opening Remarks by Session Chair

4:45 pm - 5:05 pm
Tolga Tekin
Tolga Tekin
Group Manager
Fraunhofer IZM

Photonics Systems for High Performance

5:05 pm - 5:25 pm
Natarajan Rajasekaran
Natarajan Rajasekaran
R&D Engineer of 3D and Silicon Photonics Technologies Department
imec

Overview on Imec’s Photonics Technology Platforms

5:25 pm - 5:45 pm
Daniel Lieske
Daniel Lieske
Senior Expert Advanced Packaging
AEMtec GmbH

State of the Art and Novel Wafer Level Solder Bumping Techniques for Heterogenous Integration to Build Smart and Smarter Systems

5:45 pm - 5:50 pm
Ivan Nikitski
Ivan Nikitski
Technology Manager
EPIC

Key Takeaways by Session Chair

5:50 pm - 6:00 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

6:30 pm - 10:00 pm
Dirk Hilbert
Dirk Hilbert
Mayor
Dresden City Council

Welcome Remarks

The Networking Dinner will take place on a cruise at the Elbe River and will include Welcome Remarks by the Mayor of Dresden Dirk Hilbert.
The cruise is located within walking distance of the Hilton Dresden Hotel.

Dress code: Business Smart

The exact cruise location will be available soon.

DAY 3 | Wednesday, June 28

Solder bump interconnects are still the main method to vertically transport signals from device to device in today's advanced 3D packaging. Hybrid bonding enjoys distinct advantages here at ultra-high densities or rather enables them in the first place, and is thus catching up with the increasing number of high-performance applications. Nevertheless, both today and in the future, there is still a need for alternative and new approaches to interconnects, which will be highlighted in this session. In addition to electrical interconnects, other physical interface concepts such as optical or microfluidic interfaces that allow for higher-order overall 3D systems are also of interest. As the session title already suggests, besides interconnect technologies, innovative process approaches for 3D integration at the package and chip level will also be offered a platform here.

9:00 am - 9:10 am
Thomas Schmidt
Thomas Schmidt
Product Manager Bonder
SÜSS MicroTec

Opening Remarks by Session Chair

9:10 am - 9:30 am
Pascal Metzger
Pascal Metzger
CEO
SET Corporation S.A.

High Precision Die-to-Wafer Hybrid Bonding: Key Factors for Success

9:30 am - 9:50 am
Luc Augustin
Luc Augustin
CTO
Smart Photonics

Putting Light Into Your Chips: Heterogeneous Integration of InP Photonics

9:50 am - 10:10 am
Markus Wimplinger
Markus Wimplinger
Corporate Technology Development and IP Director
EV Group

Nanocleave – Enabling Next Generation 3D Integration

10:10 am - 10:25 am
Herbert Oetzlinger
Herbert Oetzlinger
CEO
SEMSYSCO, a Lam Research company

Roadmap on Wet Processing for Advanced PLP Technology

10:25 am - 10:45 am
Anne Jourdain
Anne Jourdain
Principal Member of Technical Staff, Team Lead 3D Heterogeneous Integration
imec

Micro-bump Technology Overview for 3D Heterogeneous Integration

10:45 am - 11:15 am

Coffee Break

11:15 am - 11:35 am
Roland Rettenmeier
Roland Rettenmeier
Product Marketing and Business Development
Evatec

Thin Film Technology for Heat Dissipation Layers in High Performance Computing Applications

11:35 am - 11:55 am
Michael Töpper
Michael Töpper
Senior Expert Heterointegration
Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics

Heterointegration: A Solution for Environmentally Friendly System Integration?

11:55 am - 12:00 pm
Thomas Schmidt
Thomas Schmidt
Product Manager Bonder
SÜSS MicroTec

Key Takeaways by Session Chair

12:00 pm - 12:10 pm
Eric Beyne
Eric Beyne
Senior Fellow, VP R&D, Director 3D System Integration Program
imec

Conference Reflections of 3D & Systems Summit Committee

12:10 pm - 12:20 pm
Laith Altimime
Laith Altimime
President
SEMI Europe

Closing Remarks

12:20 pm

End of Conference

REGISTRATION

Dresden Networking Dinner

Conference price:

  • SEMI Members: 950 EUR
  • Non-members: 1,250 EUR 

* VAT excl.

**Tickets for the Networking Dinner Cruise are sold separately, if you want to register for it, click here

Registration includes:

  • Access to all 3D & Systems Summit sessions
  • Access to the exhibition area
  • All conference proceedings
  • Coffee breaks and lunches are mentioned in the agenda section of the conference website
  • Networking reception on Conference Day 1, Monday, June 26, 2023

Cancellation Policy:

  • Conference ticket:
    • A 25% cancellation fee applies until April 30, 2023.
    • No refund possible after May 1, 2023.
  • The Networking Dinner Cruise ticket is non-refundable. 

The Networking Dinner Cruise will take place on Tuesday, June 27 (Day 2 of the Conference) at the Elbe River.

Price for the Networking Dinner Cruise:

  • Summit Attendee Ticket: 129 EUR
  • Spouse Ticket: 149 EUR

* VAT excl.

**Networking Dinner registration is only for 3D & Systems Summit 2023 participants. 

Registration is available here

If you are interested in purchasing a ticket for your spouse, please contact euevents@semi.org

+
Dresden Networking Dinner

Exhibition

Exhibition 2023

3D & Systems Summit 2023 Europe Floorplan

 

Booth price

  • SEMI member: 3,450 EUR*
  • Non-SEMI member: 3,850 EUR*

* VAT excl.

Exhibition fee includes:

  • 1 booth
  • 1 free entry ticket 
  • 1 discounted entry ticket 

Booths have a structure of 2.5m height with back walls of 2m wide and sidewall of 1m wide. The depth of the booth is 2m.


Modular booth includes:

  • Booth space (2m x 2m)
  • 1 signboard with exhibitor name (up to 25 letters)
  • 1 table (80 x 80 x 72cm)
  • 2 chairs 
  • 1 paper bin
  • 1 set spotlight LEDs 40W
  • 1 triple extension socket

Exhibitors on corner positions may request in advance that the sidewall be removed.

Exhibition Package


Contact: euevents@semi.org

CONFERENCE

1

Hilton Dresden Hotel

An der Frauenkirche, 5
D-01067 Dresden
Germany
Tel. 0049 (0)351 86420

ACCOMMODATION

Booking link for Hilton Dresden: click here

  • Room rate starts at 149 EUR per night
  • Booked rooms are cancellable free of charge till 7 days prior to arrival
  • For booking a room a guarantee by credit card is mandatory
  • The offered room rate is including our Hilton Breakfast buffet, service charge, and VAT

For further hotel booking options: click here

1

Sponsors

Platinum

Gold

Silver

Event

Sponsorship Opportunities

Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships. 

Contact: Adi Hodorov at ahodorov@semi.org

 

Sponsorship Package  Sponsorship Agreement  Post Show Report 2023

 

 

Are You Already a Sponsor?

Make the most out of your sponsorship and take advantage of the graphical material at your disposal.

In the digital library, you can find the Summit’s logo, PowerPoint templates, and banners.

 

Digital Library

 

 

Media Partners

 SEMI is proud to partner with the following media and associations to bring you news about this event. If you are interested in partnering with us, please contact Serena Brischetto at sbrischetto@semi.org

3D InCities
 
CEA-LETI CSR
Clean room future
Date imicronews
Mems_200px OES Semiconductor-Packaging-News Silicon Saxony Smart_system_200px  

We Thank Our Committee Members

Special thanks to our Committee Members for the realization of 3D & Systems Summit! 

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