June 26, 2023 - June 28, 2023
Smarter Systems through Heterogeneous Integration
3:00 pm - 12:30 pm
Dresden Hilton Hotel
An der Frauenkirche 5 D
The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore's Law plateauing. Therefore, continued developments and innovation are essential to growing the business.
Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies.
Several B2B matching opportunities await during the conference, including networking reception, coffee breaks, lunches, and a unique Networking Dinner Cruise at the beautiful Elbe River.
DAY 1 | Monday, June 26
Advanced Packaging: Enabling Moore’s Law’s Next Frontier
The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing. Applications such as autonomous driving, 6G, the internet of things (IoT), artificial intelligence, machine learning, etc. have had tremendous growth and brought new opportunities for innovation. This session will focus on the industry trends and market drivers that affect the industry moving forwards.
Panel Discussion: How Does the Supply Chain Challenges Restructured Translate the Customer-Supplier Relationships?
Dresden Hilton Hotel
An der Frauenkirche 5 D
DAY 2 | Tuesday, June 27
Over the last few decades, 3D technologies have always provided promise for future applications. We are now delivering on this promise. As the 3D ecosystem has tackled many of the key difficulties we are now seeing high-volume applications with increasing 3D technology content. This momentum is driving 3D technologies into the front-end processes to enable increasing integration densities at excellent yields. This session will discuss the progress and collaborations across the 3D ecosystem towards increasing contribution to sustaining the pace of Moore’s law.
Continued performance scaling is not only driven by classical device scaling, however 3D integration in various flavors plays a key role in meeting future performance gains. Agreement prevails on the intersection of 10µm pitch from solder based interconnects to solid-state hybrid bond interfaces. Besides wafer-to-wafer also die-to-wafer hybrid bonding is determining future system design and manufacturing flows. In this section, we discuss all relevant aspects of hybrid bonding from central preparation processes and materials to actual bonding equipment.
PECVD Dielectrics for Inter-Die Gap Fill in Hybrid Bonding Applications
An insight into Chip to Wafer Hybrid Bonding
Recent Advances in Direct Hybrid Bonding
Nowadays, addressing the challenges and opportunities arising from heterogeneous integration requires dealing with all the aspects related to their design: from the architecture and programming models to hardware/software integration and orchestration to real-time and security requests. This session will address modern heterogeneous systems and their evolution.
MOSAICS-LP: A Scalable Chiplet Platform
3D Integration and Design
Enabling a Chiplet Ecosystem: Standardization of Heterogenous Integrated Chiplet Models
Solder bump interconnects are still the main method to vertically transport signals from device to device in today's advanced 3D packaging. Hybrid bonding enjoys distinct advantages here at ultra-high densities or rather enables them in the first place, and is thus catching up with the increasing number of high-performance applications. Nevertheless, both today and in the future, there is still a need for alternative and new approaches to interconnects, which will be highlighted in this session. In addition to electrical interconnects, other physical interface concepts such as optical or microfluidic interfaces that allow for higher-order overall 3D systems are also of interest. As the session title already suggests, besides interconnect technologies, innovative process approaches for 3D integration at the package and chip level will also be offered a platform here.
Nanocleave – Enabling Next Generation 3D Integration
Micro-bump Technology Overview for 3D Heterogeneous Integration
The exponentially growing data traffic is becoming a serious concern and will soon account for over 10% of global electricity consumption. The rescue could be found in Photonics – the technology that uses light to carry information. Integrating photonics on the chip level will provide low-energy, high-speed data transmission throughout the internet, as well as within data centers. Photonics also enables sensing and vision applications in healthcare, autonomous driving, and smart farming. However, the increasingly complex photonic chips must be produced at a much lower cost to live up to these expectations.
The Networking Dinner will take place on a cruise at the Elbe River.
The cruise is located within walking distance of the Dresden Hilton Hotel. Boarding of the cruise will start at 7:30 pm and it will leave shore at 8:00 pm.
The exact cruise location will be available soon.
DAY 3 | Wednesday, June 28
Sustainability and the associated integration of environmental and social aspects into the industry are of crucial importance to ensure livable conditions for current and future generations. This session will focus on how the semiconductor industry, technology, and digitalization can be used to reduce greenhouse gas emissions, and waste generation, and to improve waste disposal, water, and materials recycling, as well as social impacts. In this context, alignment with upcoming regulations, proper goal setting, and assessment of the achievements will affect our industry as it progresses.
Heterointegration: A Solution for Environmentally Friendly System Integration?
In recent years, significant progress was realized for materials, processes, and equipment to support 3D assemblies for scaling well-established interconnect technologies like flip chips as well as to improve the manufacturing maturity of newer technologies like hybrid bonding or optical interconnects. This extends the implementation of 3D integration in a wider range of products. This session demonstrates examples of how 3D technologies enable new applications.
The Next Generation of 3D Products from Mobile to Data Center
Conference Reflections of 3D & Systems Summit Committee
End of Conference
- SEMI Members: 950 EUR
- Non-members: 1,250 EUR
* VAT excl.
**Tickets for the Networking Dinner Cruise are sold separately, if you want to register for it, click here.
- Access to all 3D & Systems Summit sessions
- Access to the exhibition area
- All conference proceedings
- Coffee breaks and lunches are mentioned in the agenda section of the conference website
- Networking reception on Conference Day 1, Monday, June 26, 2023
- Conference ticket:
- A 25% cancellation fee applies until April 30, 2023.
- No refund possible after May 1, 2023.
- The Networking Dinner Cruise ticket is non-refundable.
The Networking Dinner Cruise will take place on Tuesday, June 27 (Day 2 of the Conference) at the Elbe River.
Price for the Networking Dinner Cruise:
- Summit Attendee Ticket: 129 EUR
- Spouse Ticket: 149 EUR
* VAT excl.
**Networking Dinner registration is only for 3D & Systems Summit 2023 participants.
Registration is available here.
If you are interested in purchasing a ticket for your spouse, please contact email@example.com.
Exhibition 2023 Book a booth now
- SEMI member: 3,450 EUR*
- Non-SEMI member: 3,850 EUR*
* VAT excl.
Exhibition fee includes:
- 1 booth
- 1 free entry ticket
- 1 discounted entry ticket
Booths have a structure of 2.5m height with back walls of 2m wide and sidewall of 1m wide. The depth of the booth is 2m.
Modular booth includes:
- Booth space (2m x 2m)
- 1 signboard with exhibitor name (up to 25 letters)
- 1 table (80 x 80 x 72cm)
- 2 chairs
- 1 paper bin
- 1 set spotlight LEDs 40W
- 1 triple extension socket
Exhibitors on corner positions may request in advance that the sidewall be removed.
An der Frauenkirche, 5
Tel. 0049 (0)351 86420
Booking link for Hilton Dresden: click here
- Room rate starts at 129 EUR per night
- Booked rooms are cancellable free of charge till 7 days prior to arrival
- For booking a room a guarantee by credit card is mandatory
- The offered room rate is including our Hilton Breakfast buffet, service charge, and VAT
For further hotel booking options: click here
Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships.
Contact: Adi Hodorov at firstname.lastname@example.org
Sponsorship Package Sponsorship Agreement Post Show Report 2022
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We Thank Our Committee Members
Special thanks to our Committee Members for the realization of 3D & Systems Summit!