FlexTech Master Classes Available
Class Number |
Name |
Original Date |
Instructor |
| FTMC001 | Flexible Power Sources | July 2020 | Brian Berland, ITN Energy |
| FTMC002 | AI in Thin-Film Manufacturing | August 2020 | Cornell University |
| FTMC003 | Hybrid Integration for Flexible Electronics | September 2020 | Robert Street, PARC |
| FTMC005 | Flexible Batteries | April 2021 | J. Devin MacKenzie, Univ. of Washington |
| FTMC006 | AI Enhanced Microfabrication and Printed Electronics | May 2021 | Cornell University |
| FTMC007 | FHE 2.0 based on Fan-Out Wafer Packaging | June 2021 | Subramanian Iyer, UCLA |
| FTMC008 | Printing, Curing & Characterization Methods for Printable Conductors | September 2021 | Mike Mastropietro, ACI Materials |
| FTMC009 | Optimizing Design and Fabrication of FHE for Medical and Industrial Application | October 2021 | Mark Poliks, Binghamton Univ. |
| FTMC010 | Environmental Sustainability for FHE & Microelectronics | November 2021 | Toni Mattila, Biz Finland |
| FTMC011 | The Next Generation of Printed Electronics | June 22, 2022 | J. Devin MacKenzie, Univ. of Washington |
| FTMC012 | Additive Manufacturing and Robotics | October 19, 2022 | Greg Whiting & Robert MacCurdy, Univ. of Colorado, Bolder |
| FTMC013 | FHE Market & Forecast | November 16, 2022 | Dr. Matthew Dyson, ID TechEx |
| FTMC014 | How to Write & Protect Your Patent | December 7, 2022 | Harvey Kauget, Burr & Forman LLP |
| FTMC015 | Fundamentals of Electrochemical, Aptameric-based Sensors | November 2, 2023 | Dr. Jack Ly, UES |
| FTMC016 | Introduction to Hybrid Bonding for Advanced Packaging | November 8, 2023 | Dr. Arsalan Alam, AMD |
See the Fun at FLEX 2022
Our Upcoming Presentations
Presentations by SEMI, FlexTech, NextFlex, or NBMC representatives regarding flexible electronics.
- Check back for updates