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Focused Solicitations

Since 1993, SEMI FlexTech has funded over 200 projects in R&D, with a total public/private investment in excess of U.S. $220 million. SEMI FlexTech solicits proposals from the flexible electronics industry for candidate projects which will receive funding. 

2023 FlexTech RFP

2023 SEMI FlexTech Focused Solicitation (RFP) released 5/11/2023 - white paper due date 6/5/2023

FlexTech RFP Webinar

Watch the May 25 webinar reviewing the RFP process, the Proposal Topics, and other information on submitting successful White Papers and Final Proposals.

There is also a concurrent 2023 SEMI NBMC Focused Solicitation (RFP) released 5/5/2023 - white paper due date 6/5/2023 - Download the Full RFP

NBMC RFP WEBINAR:  5/17/2023 10:00 am PDT Register

R&D Programs Contract History

SEMI-FlexTech Contract History
SEMI-NBMC Contract History
NextFlex Contract History

Development Agreement Award Process

Through a competitive bid process supported by the Technical Advisory Council and Industry Governing Council, project proposals are selected for available funds. The typical funding is structured as a 50/50 cost share with the industry participant. Please see the SEMI-FlexTech Contract History link below for more information on the projects that have been funded to date.

R&D projects are supported for the development of innovative new equipment & process technology for front-end and back-end manufacturing process steps; new materials and components; and for software, hardware and design analysis for factory automation and CIM operation.

The technical program is funded with the assistance of the U.S. Army Research Laboratory (ARL). Each year the ARL provides funding to SEMI-FlexTech for allocation to the technical projects of interest. The mission of ARL is to enable technologies that will meet future Army combat needs and solve the critical technical barriers that limit the performance, reliability, functionality and affordability of battlefield systems. The partnership funds technology advancements in the supply chain that will meet the military and consumer needs.  For a recent example of a SEMI FlexTech project, read this blog.

The SEMI-FlexTech Technical Advisory Council (TAC) establishes the content and priority for the elements of the technical program. They have maintained an emphasis on creating next generation capability for flexible and printed electronics, while assuring optimized cost-of-ownership.

Member companies provide corporate resources to lead and to staff the project teams responsible for:

  • Request for Proposal topics and target requirements
  • Proposal selection defining the statement of work in concert with the chosen supplier
  • Development program oversight
  • Beta-site evaluation of the developed equipment/materials

Proposals for awards are selected from the RFP responses based upon factors such as innovation, level of risk, cost effectiveness, performance history and the ability to provide a substantial cost share.

The award process is typically done in two stages. The first stage is submission of a white paper proposal which is evaluated and selected by the Technical Advisory Council. These white papers are then offered the opportunity to submit full proposals. The final proposals are evaluated by the Technical Advisory Council and then recommendations are presented to the Industry Governing Council. The Industry Governing Council reviews the recommendations and conducts their own evaluations before making the final selections.

RFP Process Simple

The Impact of Flexible and Printed Electronics