Intelligent Sensing for Better and Smarter Living

The session will explore diversity's link to innovation, and how companies and leaders can create an inclusive environment where employees prosper, and innovation thrives.

The semiconductor industry is experiencing unprecedented times, with growth across all the different market segments and new applications, such as autonomous driving, 5G, internet of things (IoT), artificial intelligence, machine learning, among others, bringing new opportunities for innovation. This session will focus on the industry trends, market drivers and supply chain dynamics and how these affect our industry moving forwards.

The focus of this session is to discuss edge processing in MEMS and how there is a great need for new types of sensor technologies that perform better computational processes along with sensing.

MEMS devices are now used in many engineering applications, with new manufacturing technics and equipment. This allows for next-generation MEMS devices in this area to perform better still ensuring quality. All these issues will be discussed in this session.

This session will address emerging applications related to sensors. The focus will be given on the latest developments in biosensors, addressing MEMS, photonics and spectroscopic technologies. Some of the key stakeholders will be presenting their vision of the future and, as the medical and consumer worlds start to coincide, where do the next opportunities lie.

The session focuses on the development of MEMS technology in both, new applications and devices as well as on new trends in manufacturing. On the application side integration of several sensors into SiP, more MEMS in medical sensing and integration of data generation and data processing into the same system are examples of development directions. In manufacturing, advancements are visible in moving towards 300 mm wafer sizes, 3D integration and a diversification of used substrate type.

For many years imaging technology has demonstrated an unprecedented ability to improve performance or to create new specific solutions to meet market requirements. During this session, key opinion leaders will expose their vision of the technological evolution of the sensing process; design and computing.

Recent and future applications of environmental MEMS technology that range from preventative maintenance and quality control to environmental monitoring are gaining more notoriety every day. This session will explore topics in this area and will be addressing what the future will be.

If your business happens between 1 and 2 mm, you do not want to miss this session. We will hear the latest advances in the traditional SWIR imaging technology from Lynred. Moreover, we will discover the promise of new quantum dot SWIR image sensors with ST Microelectronics and Emberion. We will be inspired by how more affordable sensors enable new applications for consumers (Imec) and by a low-cost solution for SWIR hyperspectral imaging introduced by VTT.

The rapid growth of cloud data, accelerated by AI applications combined with the limitations of Cu interconnects in the data infrastructure, in terms of ability to handle associated speed and bandwidth requirements, presents challenges that can be overcome with the use of optical interconnects and heterogeneous integration of optical and electronic components. Co-Packaged Optics (CPO) brings optics and silicon together in the same package, improving performance to meet industry demands, but also reducing power consumption.