DRESDEN, Germany — April 4, 2023 — Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, June 26-28, 2023 in Dresden, for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent systems. The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies. Registration is open.
“We look forward to hosting industry leaders at the 3D & Systems Summit as they deliver insights into cutting-edge advanced packaging solutions,” said Laith Altimime, President of SEMI Europe. “Packaging innovations are critical to semiconductor industry growth, increasing chip performance, reducing power consumption and enabling smaller end devices for emerging and growing segments including autonomous driving, 6G, Internet of Things (IoT), artificial intelligence (AI), and machine learning.”
Themed Smarter Systems through Heterogeneous Integration, this year’s 3D & Systems Summit will feature a broader scope of topics including:
- Advanced Packaging: Enabling Moore’s Law’s – The Next Frontier
- Market Briefing and Technical Roadmap
- Industrialization and Mass Adoption of 3D Technologies
- Hybrid Bonding Developments
- Chiplet Design Packaging: Architectures and Challenges
- Novel Processes and Interconnect Solutions for 3D
- Photonics Integration
- Sustainability
- Applications Enabled by 3D
3D & Systems Summit Distinguished Speakers
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Seung Kang, VP of Strategy Adeia, Inc. |
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Raja Swaminathan, Corporate VP AMD |
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Rozalia Beica, VP Strategic Marketing & Business Development, Microelectronics Business Unit AT&S China |
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Yoan Dupret, Managing Director and CTO Menta |
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Pascal Metzger, CEO SET Corporation S.A. |
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Luc Augustin, CTO Smart Photonics |
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E. Jan Vardaman, President TechSearch International, Inc. |
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Emilie Jolivet, Semiconductor, Memory and Computing Division Director Yole Group |
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Global Leaders to Present
3D & Systems Summit presenters also include experts from these global leaders:
- Adeia
- AMD
- ASML
- AT&S China
- Besi
- CEA-Leti
- EPIC
- EV Group
- Fraunhofer IIS-EAS
- Fraunhofer IZM-ASSID
- imec
- Intel Corporation
- KLA Corporation
- Menta
- MKS-Atotech
- Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics
- SET Corporation S.A.
- Siemens EDA
- Smart Photonics
- SPTS Technologies Ltd., a KLA company
- SÜSS MicroTec
- TechSearch International
- Yole Group
Exhibition and Premium Networking Opportunities
The 3D & Systems Summit will feature business-to-business matchmaking and networking for exploring new partnerships and other business opportunities. This year’s networking dinner will take place on the Elbe River cruise.
To reserve an exhibition space, contact euevents@semi.org.
For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe onTwitter or LinkedIn – @SEMIEurope, #3DSummit.
Premium Sponsors
- Platinum: Adeia, Inc. and Comet Yxlon
- Gold: Racyics and SÜSS MicroTec
- Silver: Lam Research
- Event: EV Group, imec and MKS-Atotech,
About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.
Association Contacts
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: sbrischetto@semi.org
Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: mhall@semi.org