semiconductor packaging

Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies.

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies & their need for new materials and integration solutions. The two talked ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.