November 6, 2023
EU Digital Future Forum
9:00 am - 12:00 pm
Online, Central European Time (CET)
Europe lies at a crossroads with regards to the Microelectronics sector, it is imperative to ensure that the EU continues to be an attractive investment destination for the sector. The passage of the EU Chips Act was a seminal moment highlighting the efforts going forward to promote Microelectronics.
Whether addressing the skills shortage in the EU, or developing the next generation of electronic components and systems heterogeneous integration core technology solutions, collaborations between cross-functional partners all across the continent are crucial in taking the industry to the next level.
We welcome you to attend this webinar where 4 EU-funded projects will be featured, comprising of partners from all walks of life as they seek to solve the issues facing us.
The projects are:
Christopher Frieling is Director for Advocacy and Public Policy at the SEMI Europe Brussels Office. Christopher has a background in EU affairs, innovation, and tech policy. Prior to SEMI he worked at the Brussels office of Fraunhofer in several roles including most recently as Senior Advisor. Christopher holds an MSc in Economics of Science and Innovation and a Bachelor of Business Administration.
Introduction to SEMI University
Naresh Naik is in charge of managing all aspects of SEMI University including revenue generation, content and partner strategies, LMS and curriculum enhancements, and much more. Before joining SEMI, he worked at Atlassian, Inc. as Senior Leader - Training Strategy, Curriculum and Certification where he drove the strategy and development of customer-facing training programs incl. design approach, curriculum development and credentialing for 250,000+ global customers. Prior to Atlassian, he served as Senior Manager, Training and Documentation at Autodesk where he managed a global team of instructional designers, eLearning developers and technical writers.
METIS: A collective initiative to face skill shortage in the SC industry
Laurence Dassas is a Global Innovation Manager at X-FAB. Laurence joined X-FAB in 2018 and was appointed Global Innovation Manager in 2021. A passionate and result-focused manager with over 20 year experience in innovation in high tech companies. In her role, Laurence leads a team focused on leveraging and supporting innovation through the management of strategic public funded programs, developing partnerships with industrial companies and research institutes, and managing public affairs. She holds a Master degree in Materials Science. Before joining X-FAB, she worked in different organizations (from start up to large company) focusing on the development of future generation of microelectronics, spinning out technologies, lab to fab transfer, managing multidisciplinary R&D team and developing key business relationships.
METIS - Training Catalogue and Courses
Bernd Deutschmann received his M.Sc. degree and the Ph.D. degree in telecommunication engineering from the Graz University of Technology/Austria in 1999 and 2002, respectively. After his studies, he worked in the semiconductor industry from 2000 to 2014 on improving the electromagnetic compatibility (EMC) of integrated circuits. In 2014, he returned to academia and moved to the Technical University of Graz/Austria as a full professor for "Electronics" and since then heads the Institute of Electronics. His research area is the design of electronic systems and integrated circuits with a special focus on their electromagnetic compatibility. As part of his research activities, he has filed several patents and authored and co-authored numerous papers and technical articles.
Dominik Zupan has received the BSc and MSc degree in Information and Computer Engineering from Graz University of Technology, Austria. He is working towards his PhD degree at Graz University of Technology as university assistant at the Institute of Electronics (IFE). Within the METIS project he has the lead of work package 3, whose main outcome is a curriculum of training courses, based on the skills needs of the European microelectronics industry.
Lithography Training – a face-to-face and a virtual course
Yvonne Bergmann obtained a Physics diploma from Berlin Free University in 2010, PhD of Material Science from Christian Albrechts University zu Kiel in 2015. From 2013 to 2023, she worked on Equipment Engineering Lithography at Robert Bosch GmbH in Reutlingen and since 2021, she has worked on Public Funded Projects ( Arrowhead Tools, METIS, IPCEI) at Robert Bosch GmbH.
VET and Educational Activities in Microelectronics: European Centre of Vocational Excellence in Microelectronics
Manuel Castro is an Electrical and Computer Engineering Professor in the Spanish University for Distance Education (UNED). He is an expert in Applications of Simulation and Electronics and in Technology Enhanced Learning. He co-chaired the conferences LWMOOCS 2022, WEEF/GEDC 2021, LWMOOCS 2018, EDUCON 2018, REV 2016, FIE 2014. Manuel is an IEEE Fellow, IEEE HKN (Eta Kappa Nu) Professional member, President Emeritus of the IEEE Education Society and Past Director of the IEEE Division VI. He has been awarded among others: IEEE EdSoc William E. Sayle Award for Achievement in Education, TAEE (Technologies Applied to Electronics Education) Tomás Pollán to Discipline Merit, and IGIP (International Society for Engineering Pedagogy) Nicola Tesla Chain. He Is also an Honour Ambassador of Madrid Convention Bureau and past co-editor of IEEE-RITA.
Official national VET administration accreditation of ECOVEM Spanish courses
Imma Miralles has a Master's in Clinical Psychology and Gerontology degree. She is the Founder and President of Asociación FRESS, Social and Sanitary Research and Studies, a board member of CRES – Centre for Research and European Studies, Vice-President and responsible of the training committee of ACOFESAL (Association of consultants and trainers from Spain in food security) and president of ANCCP (National Association of Professional Certification Centers). Contribution in European collaborative networks like European Network of Innovation for Inclusion and representing the CEDDD (Consejo Español para la Defensa de la Discapacidad y la Dependencia) as member of Forum on Education of the EASPD (European Association of Service providers for Persons with Disabilities). She is the Manager of European and national projects for ANCCP (recently with ERASMUS+ acreditation) and for other organizations as IEF (Financial Estudis Institut) or EFPA Spain.
The added value of DEIS for the Chip Industry
Eva Fabry is Co-Founder and Director of the European Centre for Women and Technology, endorsed by the European e-Skills Association as the leading European platform for Women in the Digital Economy. Under Eva´s leadership, ECWT has grown from 16 founding members in 2008 to a multi-stakeholder-based community with National Point of Contacts in 30+ European countries. She is also Deputy Director of #GIL4W – The Greek Innovation Lab for Women launched in April 2021 by the Hellenic Ministry of Labour in collaboration with an Alliance of 15+ Greek public-private actors, academia and not-for-profit partners and ECWT.
Eva is a Member of the Future Open Council of Mobile World Capital Barcelona´s Digital Future Society Think Tank, a Member of OECD´s working group on Higher Education and Entrepreneurship. Eva graduated from the University of Oslo and the Lorand Eötvös University in Budapest.
Digital Twin Software for Finite Element Analysis
Rahul Tomar is a distinguished mechanical, civil, and software engineer with over 23 years of extensive experience in the field of engineering and technology. He is most notably recognized as the Co-Founder of DigitalTwin Technology GmbH, a groundbreaking company at the forefront of the digital twin revolution in the engineering and construction sectors. Rahul's profound understanding of mechanical and civil engineering principles, coupled with his expertise in software development, has played a pivotal role in the success of DigitalTwin Technology GmbH. He has spearheaded the development of innovative software solutions that bridge the gap between the physical and digital worlds, revolutionizing how engineers and designers approach their work. Through his leadership, DigitalTwin Technology GmbH has enabled organizations across the globe to harness the power of digital twins for real-time monitoring, predictive analysis, and collaborative decision-making. These advancements have not only improved efficiency in engineering and construction projects but have also significantly reduced costs and risks associated with complex ventures. Rahul's relentless pursuit of excellence and his unwavering dedication to pushing the boundaries of technology have left an indelible mark on the engineering and software development industries. His vision for the future of digital twin technology continues to drive innovation and transformation, making him a respected figure in the global engineering community.
Vision-based sensor fusion and perception for high-precision motion control systems
Dip Goswami is an Associate Professor in the Electronic Systems group of the Department of Electrical Engineering at Eindhoven University of Technology (TU/e). His research focuses on various design aspects of embedded control systems in resource-constrained domains such as automotive and robotics. Much of Goswami’s interests are seen in his work with PhD students, such as in resource-aware design of embedded control systems, optimization of distributed automotive systems such as vehicle platoons, embedded implementation of motion control systems, optimization and analysis of data intensive control loops. Goswami has in more than 100 high-quality scientific articles in the fields of embedded control systems, robotics and cyber-physical systems, resulting in three best paper awards. He regularly serves on technical program committees (TPC) of a number of prominent conferences in embedded and cyber-physical systems, such as DAC, DATE, RTAS, RTSS, EMSOFT, DSD and so on. He is an associate editor of the Elsevier journal Microprocessors and Microsystems and IEEE Embedded Systems Letters.
HiCONNECTS – An Introduction by NXP
Dr. Andrea Sanfilippo is currently working as Senior Manager – Public Funding at NXP Semiconductors, Munich (Germany). Previously, he worked for many years as technology planning and cooperation manager and head of the cooperation dept. for the German speaking area at Huawei Technologies in Munich (Germany) and as innovation manager in the R&D incentives domain at Deloitte and PNO, in Milan (Italy). Andrea also obtained a PhD in Physics at the Fritz Haber Inst. of the Max-Planck Society in Berlin (Germany).
Photonics Heterogeneous Integration Pilot Line
Dimitrios Velenis is the leader of the 3D and silicon photonics device and components group at imec. He has been with imec for more than 15 years, gaining experience on the benchmarking of advanced integration flows in 3D and Silicon Photonics interconnects. He has obtained M.Sc. and Ph.D. degrees from the University of Rochester. Previously, Dimitrios worked as Assistant Professor at the ECE Department at Illinois Institute of Technology, and as a Research Associate at the University of Rochester. He is author and coauthor of more than 60 papers in journals and conference proceedings.
3D-RDL & TPV-based Advanced Wafer-Level packaging Pilot Line for RF applications
Ayad Ghannam received PhD degree in Microwave, Electromagnetism and Optoelectronic from University of Toulouse III, France, in 2010. During PhD, he worked as a research engineer at Freescale Semiconductors, France branch, and LAAS-CNRS where he designed high-Q power inductors and developed an Above-IC process for their integration. After graduation, he continued working in LAAS-CNRS as a research engineer where he developed an innovative 3D interconnect technology. He is author of several scientific papers and patents in the field of RF integrated passives and wafer-level packaging. He founded 3DiS Technologies in 2014, a spinoff that offers innovating packaging and 3D system integration solutions based on a novel 3D RDL technology.
Enhanced Chip Manufacturing Developments
Daniele Pagano is Funding Project Manager at STMicroelectronics s.r.l. He has covered various positions and responsibility in Catania Wafer Fab Operations (Litography, Dry Etching, APC & SPC, Epitaxy, Quality & Process Control), past experiences in collaborative projects like IMPROVE (2012), INTEGRATE (2015), MADEin4 (2022), SATURN (2023) and nowadays HiCONNECTS and IPCEI. He is author and co-author of several publications on journals and international conferences.
This webinar is free of charge.
If you were unable to attend the session, please click on the following link to view the video.
FInd out more about EU Projects
METIS - Microelectronics Training, Industry and Skills
Addressing the skills shortage is a priority for the elevated competitiveness of the sector of the European microelectronics. An important step in this direction is a stronger industry and education collaboration. Under the coordination of SEMI, the METIS consortium, co-funded by the Erasmus+ Programme, is uniquely positioned to bridge this gap, as it will implement a new strategic approach to sectoral cooperation on skills for microelectronics by involving the key players across industry, education & training and regulatory/certification bodies.
ECoVEM - European Centre of Vocational Excellence in Microelectronics
The ECoVEM project seeks to establish a European Cooperation platform of Vocational Excellence in Microelectronics to tackle the challenges of: digitalisation, artificial intelligence, green technologies, gender equality and technology, integration of migrants. ECoVEM builds on and complements the strengths of national VET systems in countries with more-advanced VET and supports the not so advanced regions to achieve VET excellence.
HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability
HiCONNECTS is a consortium of 64 partners from 15 countries, to develop the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
IMOCO4.E - Intelligent Motion Control under Industry4.E
IMOCO4.E targets to provide vertically distributed edge-to-cloud intelligence for machines, robots and other human in-the-loop cyber-physical systems having actively controlled moving elements. IMOCO4.E will deliver a reference platform consisting of AI and digital twin toolchains and a set of mating building blocks for resilient manufacturing applications.
SEMI Europe is an active participant in EU-funded projects, given its global member base and its position as the voice of the microelectronics industry.
Learn more about ongoing projects in which SEMI Europe takes part.