Connecting mobility & microelectronics

SEMI Smart Mobility initiative has a global reach with working groups in different regions. These groups allow stakeholders along the automotive and microelectronics supply chains to discuss matters of common interest, collaborate on specific challenges, and align regional priorities.

We invite you to join these groups to collaborate with industry members and advance the development of automotive electronic systems, including semiconductors, MEMS, sensors, imaging systems, displays, and other solutions.

Addressing Material Consideration incl. SOI & WBG Semiconductor Materials​

Mission:​

• To offer input to major standardization bodies on challenges affecting co-design, flow, and architecture development required for WBG-based technologies and accelerate new materials adoption in EV technologies.​

Key Challenges:​

• Co-design/flow/ref architecture development required for WBG-based technologies​
• Requirement for standard modular approach aligned to OEM/T1 requirements​
• Requirement for alignment in standards body approach (SEMI/ECPE/VDE…. Working together)​
• Industrial Steering alignment required (SEMI GAAC, CSA Catapult - DER IC can support from UK, Global SEMI regional groups working together)​
• Accelerated rate of Power Device/System/Subsystem integration challenge including the need for system resilience​

Activities:​

• Coordinated action on bringing together the power electronics and automotive supply chains.​
• A white paper on best practices for next-generation semiconductor power electronics adoption.​
• An R&D project (or focused industry) on developing an industry power module reference standard roadmap for WBG adoption.​
• An industry assessment on the effect of electrification on the semiconductor industry, percentage, and technologies.​

Members: 

Main Contact: Alastair Mcgibbon alastair.mcgibbon@spaceforge.co.uk

*The group meets once a month​.

Cyber Security and Safety Considerations for Semiconductors​

Mission:​

• To advance awareness of issues of cyber security and safety underpinning design, implementation, adoption, and operation of semiconductors in vehicles.​

Key Challenges:​

• Raising awareness and promoting collaborative information sharing; ​
• Aligning and recommending through-life solution options, expecting coherence and correct with respect to regulations and science;​
• Engaging with external stakeholders toward a more secure and safe environment that uses semiconductors;​
• Building partnerships, addressing common challenges, harmonizing and aligning regional and global priorities, sharing information, and underpinning new business opportunities; and​
• Operating in a pre-competitive space to agree on approaches for ​legally sustainable and economically beneficial resilience in contested semiconductor systems.​

Activities:​

• The Problem Space - Might include an Infographic of the value chain identifying the three top risks/use cases on each chain tier for raising awareness. ​​[Targeting OEM, T1-T3, Tech suppliers eg. autonomy, sensor, data acquisition, semiconductor designers/manufacturers /IP holders].
• Landscape Study – standards and guidelines on security and safety-security related and how it relates to the problem ​​
• Economic value chain modeling - For instance, how might different types of secure hardware be expected to impact the supply chain and through life economics?
• Supply chain resilience whitepaper - Focusing on the potential impact of world trade zones, single source supply anticipated transition to smaller and/or different chip technologies. How can the automotive sector continue to yield the economic benefits of global markets while achieving the regulatory and availably objectives over the coming 10-20 years?​

Members: 

Main Contact: Siraj Shaikh s.a.shaikh@swansea.ac.uk

*The group meets once a month​.