heterogeneous integration

No one could have left the 3D & Systems Summit 2023 – held in late June in Dresden – with any doubt that heterogeneous integration, enabled by increasingly mature 3D packaging technologies, is becoming a key enabler of the semiconductor industry’s success in the years to come.

Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies.

SEMI spoke with Markus Hörburger, global product manager, Atotech Deutschland GmbH, about Atotech’s holistic approach to improving the reliability of advanced heterogeneous packaging through innovative chemistry solutions for fan-out wafer-level packaging (FOWLP) in 5G applications.

SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.