Munich

Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels.

SEMI spoke with Anja Maria Muesch and Dr. Philip Matthes at Merck KGaA, Darmstadt, Germany about the challenges and opportunities of generational diversity in the electronics industry workforce.

Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany.

SEMI recently spoke with Yole Développement analysts Dimitrios Damianos and Chenmeijing Liang about MEMS and imaging sensors market trends and how microelectronics-enhanced technologies are supporting the worldwide push to contain the spread of COVID-19.

SEMI spoke with Professor Christoph Kutter, executive director, Fraunhofer EMFT, about current FHE technologies and market opportunities ahead of the Get Started with Flexible Hybrid Electronics workshop organized by Fraunhofer EMFT and supported by SEMI, 15 October, 2019, in Munich, Germany.

SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” & the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018 in Munich, Germany.

SEMI spoke with Udo Gómez, SVP at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at SEMICON Europa 2018 in Munich, Germany.

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies & their need for new materials and integration solutions. The two talked ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.