Advanced Packaging Conference

SEMI spoke with Christian Driller, Vice President of Research and Development at Comet Yxlon, about opportunities to accelerate time-to-market and increase yield for advanced packaging manufacturers through x-ray inspection.

SEMI spoke with Markus Hörburger, global product manager, Atotech Deutschland GmbH, about Atotech’s holistic approach to improving the reliability of advanced heterogeneous packaging through innovative chemistry solutions for fan-out wafer-level packaging (FOWLP) in 5G applications.

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies & their need for new materials and integration solutions. The two talked ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.