semiconductors

SEMI spoke with Markus Hörburger, global product manager, Atotech Deutschland GmbH, about Atotech’s holistic approach to improving the reliability of advanced heterogeneous packaging through innovative chemistry solutions for fan-out wafer-level packaging (FOWLP) in 5G applications.

Medical device companies are crucial for advancements in healthcare, yet the medical industry has struggled to attract sufficient venture capital in recent years. SEMI spoke with Tom Vanhoutte, partner at imec.xpand, about investment trends in medical technology innovation.

SEMI spoke with Dr. Mikko Söderlund, sales director for Beneq’s semiconductor business, about trends in Atomic Layer Deposition (ALD) applications. Söderlund shared his views ahead of his presentation at SEMI MEMS & Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France.

Autonomous vehicle design can only thrive with the development of an industry standard for chip and device traceability across the supply chain. The importance of chip traceability to the automotive industry is reflected in its central role in driving a chip traceability standard.

As we define industry standards for managing data in the fab and beyond, we are creating a virtuous circle. More data create better processes. Better processes generate more good data, and more good data lead to better processes. It becomes a cycle of continuous improvement.

The SEMI Talent Forum, 2-3 May, 2019 in Bristol, UK will explore new opportunities and challenges of the digital era and the industry’s need for talent and the knowledge and skills in automation, computerization and digitization to drive tech innovation.

SEMI spoke with Andy Collins, manager at Quantum Technology Enterprise Centre (QTEC), ahead of the SEMI Talent Forum (2-3 May, 2019, in Bristol, UK) about the impact of emerging technologies on the future of work in the semiconductor industry.

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering, in-process warp control, as well as the associated production methodology that provides rapid prototyping & high-volume manufacturing.

SEMI met with Erez Halahmi, VP at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in Dresden, Germany.

SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape.