downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
ASMC Home AGENDA REGISTER SPONSORSHIP AUTHOR KIT

Author Instructions

Submit Your ASMC 2023 Paper HERE!

  • ABSTRACT TOPICS
     
  • All technical manuscripts, regardless of presentation format, will be published in the ASMC 2023 proceedings. Authors who missed the call for papers should consider submitting an abstract in the 'Breaking News' category.

We strongly recommend that authors receive management approval, including travel support, in advance of abstract submission. If you cannot confirm that your paper will be presented in person, either by yourself, a co-author, or a qualified speaker, your paper will not be published. 

Your health and safety is our top priority. SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events. We will continue to monitor the guidance of public health authorities and government agencies going forward and will make appropriate adjustments in the future based on that guidance. Additional details or changes about policies and procedures will be posted on the ASMC event website as they are made available. If you have any questions, please contact: Taylor Zhao at tzhao@semi.org

It is critical that you include in your timeline company approval cycles, which may be a longer process than the preparation of the actual manuscript and presentation. Please note the following dates and share this information with your co-author(s) and management. Conference registration is a requirement for participation and to receive the ASMC 2023 proceedings. Dates are subject to change.

 

2021 Best Paper Award Winners 

(2022 Best Paper Award Winners will be announced in April 2023)

2021 Best Paper Award Sponsored by Entegris

Influence of Resist Profile on Deep Reactive Ion Etch (DRIE) Sidewall Morphology
Shubhodeep Goswami, Robert Macdonald, Renner Ruffalo, Matthew Edmonds, Charles Szymanski
GE Research

2021 Best Student Paper Award Sponsored by GLOBALFOUNDRIES

Automated and Optimized Lot-To-Order Matching in 300mm Semiconductor Facilities
Christian Flechsig, Jacob Lohmer, Rainer Lasch
Technische Universität Dresden
 

Important Due Dates and Instructions

Call for Papers August 22, 2022 Instructions regarding abstracts submissions located on the ASMC 2023 call for abstracts. Information also located on abstract collection site. Download ASMC Abstract Template. 
Abstracts due October 21, 2022 Submit abstract(s) to ASMC 2023 collection site.
Authors notified December  2022 Primary contact for abstract will be notified of status.  Email notification includes unique link for manuscript upload.
Speaker Letter of Agreement form (accepted abstracts)
Manuscript due for review February 10, 2023 Authors submit manuscript for review by technical committee members. Authors should use the IEEE Manuscript template (letter) available here.
Final manuscript due April 14, 2023 Final, company-approved manuscript (PDF ONLY) and must be submitted electronically to the ASMC collection site in order to be published in the ASMC 2023 proceedings. First, upload your manuscript (preferably a DOC) to IEEE PDF eXpress: https://ieee-pdf-express.org using the Conference ID, which will be provided prior to manuscript submission. You will need to create a new account. After you receive the approved PDF from IEEE, upload the PDF to the Catalyst site. Make sure to complete the copyright form, then click save and submit.  You will receive a confirmation once completed.
Presentations Due April 14, 2023

We strongly encourage speakers to use the ASMC PPT Template (16x9). We strongly recommend that you peer-review your presentation to ensure that graphics are clear and sufficient material to fill your presentation time (20 minutes). 

Conference Dates May 1-4, 2023 A reduced speaker registration rate is available. A student rate is also available. Contact Taylor Zhao at tzhao@semi.org with immediate questions. 

Manuscript Instructions

All authors are required to submit a preliminary manuscript (PDF or DOC) to the ASMC collection site. This manuscript should reflect the complete/final manuscript, e.g. contain at least 90%-100% of content. Final manuscript only must be processed through IEEE PDF eXpress. The initial manuscript does not need to be processed through IEEE PDF eXpress

Final, company-approved manuscripts, follow these steps (after receiving final input from reviewers):
1. Process manuscript through IEEE PDF eXpress to ensure IEEE compliance.
2. Convert document at https://ieee-pdf-express.org/. Conference ID will be provided. Please follow instructions as directed.
3. Save IEEE compliant PDF on the ASMC 2023 submission site. DO NOT PASSWORD PROTECT PDF.
4. IEEE e-Copyright form is due during round one (preliminary manuscript upload)

Maximum number of pages is six (6); minimum four (4) pages. Authors will be provided feedback to ensure the highest technical quality of manuscripts. If you have misplaced your ID and password, please contact Taylor Zhao at tzhao@semi.org.