SEMICON Europa

SEMI spoke with Ian Campbell, CEO of OnScale, about the era of Cloud Engineering Simulation, and how it can reduce the costs and risks of new technology development and speed time-to-market in spaces like semiconductors, MEMS sensors, RF front ends, biomedical and driverless cars.

SEMI spoke with Markus Hörburger, global product manager, Atotech Deutschland GmbH, about Atotech’s holistic approach to improving the reliability of advanced heterogeneous packaging through innovative chemistry solutions for fan-out wafer-level packaging (FOWLP) in 5G applications.

Medical device companies are crucial for advancements in healthcare, yet the medical industry has struggled to attract sufficient venture capital in recent years. SEMI spoke with Tom Vanhoutte, partner at imec.xpand, about investment trends in medical technology innovation.

SEMI spoke with Michael Strübin, Director of Digital Health at MedTech Europe, about how healthcare systems are moving towards a sustainable path through improvements in areas such as prevention of illness, patient empowerment, lean systems and low-carbon alternatives.

Autonomous vehicle design can only thrive with the development of an industry standard for chip and device traceability across the supply chain. The importance of chip traceability to the automotive industry is reflected in its central role in driving a chip traceability standard.

SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.

SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” & the need for a collaborative approach ahead of his presentation at the Strategic Materials Conference at SEMICON Europa 2018 in Munich, Germany.

SEMI spoke with Udo Gómez, SVP at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at SEMICON Europa 2018 in Munich, Germany.

SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions.

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018 in Munich, Germany.