SEMI Award North America Recipients

The SEMI Award for North America was established in 1979 to recognize enabling technical contributions by individuals and teams to the microelectronics industry.

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Year	Recipient	Contribution	Area
2021	Everspin Technologies	Development and first Commercialization of STT-MRAM Memory	Process and Technology Integration
2020	ASML	Commercialization of Extreme Ultra Violet Lithography (EUV) Commercialization of Extreme Ultra Violet Lithography (EUV)	Manufacturing Process and Process Equipment
2019	Waymo (formerly the Google self-driving car project)	First Commercialization of Autonomous Vehicles for Public Roads	Automotive
2018	Philip Gadd, Intel	Developing and producing the first high volume monolithic photonic transmitting and receiving transceiver.	Process and Technology Integration
2017	Bryan Black, PhD, AMD	Integration of the "Fiji" graphics 3D-SiP	Process and Technology Integration
2017	Micron	Development of the Hybrid Memory Cube and Co-Founding the Hybrid Memory Cube Consortium	Process and Technology Integration
2015	Prof. Chenming Hu, Ph.D.	Development of the BSIM Families of Compact Transistor Model	Process and Technology Integration
2015	Alex Lidow, PhD	Commercialization of GaN Power Devices	Process and Technology Integration
2014	Terry Brewer, Ph.D., President, Brewer Science	Invention and commercialization of anti-reflective coatings used in optical lithography Dr. Terry Brewer invented an anti-reflective coating that was effective in eliminating reflective interference and provided good adhesion to multiple materials and resist. At the time, anti-reflective coating were a radical approach. Brewer Science, Inc., founded in 1981, developed and commercialized anti-reflective coating materials instrumental in the industry’s progress from g-line to 248nm to 193nm lithography, and now to extreme ultraviolet (EUV) and directed self-assembly (DSA) technology.	Lithography
2014	Jason C.S. Chang Chief Executive Officer and Chairman of the Board	Commercialization of copper wire bonds In the 1980s the semiconductor industry began exploring less costly alternatives for wire bonding. In 2006, Jason Chang and Tien Wu of ASE committed to underwrite risk, resolve technical problems, and address customer concerns. In 2007 they started working with materials and equipment vendors to establish a supply chain and also with foundries to establish metallurgy for bonding pads compatible with copper wire bonds. In 2009, Chang and Wu had dramatic results with a few selected customers. By 2013, more than half of ASE production was in copper wire bonds and today it exceeds 70 percent. ASE moved copper wire bonds into volume production and the industry continues to benefit from their efforts.	Assembly and Packaging
2013	Dr. Mark Law, University of Florida Dr. Kevin Jones,University of Florida	Developed a cornerstone of the modern era of computational modeling of CMOS fabrication process with the Florida Object-Oriented Process Simulator (FLOOPS) which was introduced in 1990. FLOOPS has developed into a widely used, flexible code for multi-dimensional modeling for advanced IC fabrication processes.	Process and Technology Integration
2013	Grigor Gasparyan, Xilinx Liam Madden, Xilinx Dr. Steve Trimberger, Xilinx Suresh Ramalingam, Xilinx Steve Young, Xilinx Trevor Bauer, Xilinx Kumar Nagarajan, Xilinx (now with Maxim Integrated)	Commercialization of the silicon interposer which provides more than two orders of magnitude increase in die-to-die bandwidth per watt. This achievement effectively addressed both challenges of decreasing power and increasing bandwidth for advanced digital ICs. It also decreased latency to only 20 percent for standard input/output connections.	Assembly and Packaging
2012	Mark Bohr, Intel Robert Chau, Intel Suman Datta, Pennsylvania State University (formerly with Intel) Mark Doczy, Intel Brian Doyle, Intel Tahir Ghani, Intel Jack Kavalieros, Intel Matthew Metz, Intel Kaizad Mistry, Intel	The Intel team was honored for their contribution to the first development, integration and introduction of a successful high-k dielectric and metal electrode gate stack for CMOS IC production, first implemented at the 45nm node in 2007	Process and Technology Integration
2011	Moungi Bawendi, MIT professor, QD Vision Science Advisory Board Vladimir Bulovic, MIT professor, QD Vision Science Advisory Board, QD Vision founder Seth Coe-Sullivan, QD Vision founder and CTO John Ritter, QD Vision, EVP of Product Development and Operations Jonathan S. Steckel, QD Vision founder and director of Chemistry	Commercialization of Quantum Dot (QD) technology	Materials and Process Integration
2010	Thomas DiStefano, Founder, Tessera John Smith, former CEO, Tessera Michael Warner, former VP Engineering & Product Development, Tessera	Commercialization of the uBGA Technology	Advanced Packaging
2009	Robert Patti	Pioneer work in the emerging technical area of 3D IC integration	Assembly and Packaging
2009	Andrew Hawryluk James McWhirter Michael Thompson Yun Wang	Annealing using grazing-angle IR laser beams	Wafer Fabrication
2008	Yoshio Nishi	Memory Development and Visionary R&D Management	Lifetime Achievement
2008	Chris Auth Mark Bohr Robert Chau Tahir Ghani Kaizad Mistry Anand Murthy Scott Thompson	Process Integration of Strain-enhanced Mobility Techniques for CMOS Transistors	Process Integration
2007	Bernard S. Meyerson	SiGe for Wireless Application	Lifetime Achievement
2007	C. Grant Willson	Chemically Amplified Resist	Lithography
2006	Igor Khandros	Wafer Test	Test Equipment
2005	Jim Koford	Integrated Circuit Design and Test Automation	Lifetime Achievement
	Bob Shillman Bill Silver Marilyn Matz	Machine Vision Systems	Enabling Equipment
2004	Lee Galbraith George Kren	Particle Detection System	Metrology
2003	Arthur Evans	Blade Type Fixed-Point Probe Card	Test Equipment
2003	Chris Mack	Lithography Modeling	Lithography
2002	Richard Spanier	Metrology	Lifetime Achievement
	Tom Hedges Tom Schaefer Carl Smith Roger Sturgeon Mark Zimmer	Device Design-to-Manufacturing Data Transcription and Data Preparation Software	Design Database
	Glenn Tom, Ph.D. Karl Olander, Ph.D.	Safe Delivery System (SDS) Gas Storage and Delivery	Materials Technology
2001	Robert Knollenberg, Ph.D	Particle detection in semiconductor processing	Metrology
	Paul Allen, Ph.D. Hans Buhre Neil Berglund, Ph.D. Torbjorn Sandstrom, Ph.D. Anders Thuren Paul Warkentin, Ph.D.	Team for Photo mask laser pattern generation technology	Lithography
2000	Doug Scott John DeBolt Jonathan Golovin	Team for Manufacturing Execution Systems and Development of PROMIS & COMETS	Factory Integration
2000	Anwar Chitayat	Innovator and Developer of the Brushless Linear Motor	Enabling Equipment
1999	Anthony Bonora Mihir Parikh, Ph.D.	Creation and Development of SMIF	Equipment
1998	Bruce Deal, Ph.D.	Silicon oxidation technology	Lifetime Achievement
1998	William Cote William Guthrie Michael Leach	Pioneering development of chemical mechanical planarization processing	Process Technology
1997	Peter Rose, Ph.D.	Innovator/founder; ion implantation technology	Lifetime Achievement
1997	Norman Goldsmith Werner Kern	"RCA clean"; oxide CVD; BN diffusion	Process Technology
1996	Kenneth Levy	Leadership in inspection, instrumentation and metrology	Lifetime Achievement
	Robert Akins Ph.D. John Bruning Chris Sparkes Larry Thompson	Optical tooling and processes for deep UV lithography	Equipment
	Richard Brewer	Materials and process solutions for Lithography	Materials
1995	Vincent Coates	Scanning electron microscope	Metrology
1995	Arnon Gat	Rapid thermal processing	Process Equipment
1994	Martin Hammond	LPCVD	Materials Technology
	Paul Sandland	Automated wafer inspection	Metrology Equipment
	Dan Maydan David N.K. Wang Sasson Somekh	Precision 5000	Lifetime Achievement
1993	Marjorie Balazs	Yield Improvement	Process Control
1992	Griffith Resor	Wafer stepper development for IC Production	Process Equipment
1991	Robert Mazur	Automatic spreading resistance probe	Metrology
1990	Charles & Lucia Shipley	Positive photoresist	Materials Technology
1989	David Perloff	Wafer mapping	Metrology
1989	Walter Runyan	Silicon crystal growth	Materials Technology
1988	Douglas Peltzer	Oxide isolation technology	Process Technology
	Ronald Hershel Martin Lee	One-to-one wafer stepper	Process Equipment
	Dan Maydan David Wang Sasson Somekh	Plasma etch standard	Process Equipment
1987	Dick Blair Charles Drexel Dan LeMay	Mass flow controller	Process Equipment
	Mord Wiesler	Die bonding	Assembly Equipment
	Tech Tan Warren Tice	Intrinsic gettering	Materials Technology
1986	Roger Bastide Peter Rose Andrew Wittkower	Ion implantation systems	Process Equipment
	C. Arthur Lasch	Automatic wafer prober	Tech. Equipment
	Robert Walsh	Chemical-mechanical wafer polishing	Materials Technology
1985	Guenter Schwuttke	X-ray topography system	Metrology
1985	Jean Hoerni	Planar process	Process Technology
1985	Albert Soffa	Manual and automatic wire bonders	Assembly Equipment
1984	David Alles Robert Collier Donald Harriott John Stafford Michael Thomson	Electron beam exposure system	Process Technology
	Neal Stouder	Linear and high/low temperature test system	Test Equipment
	Gordon Teal	Silicon transistor	Device Technology
1983	J. Walter Carlson	Silicon quality standards	Materials Technology
	Kenneth Levy	Automated photomask inspection	Metrology
	T. Peter Sylvan	Test systems development	Test Equipment
1982	Karl A. Lang	Automatic diffusion furnaces	Process Equipment
	Lawrence Martinson	Negative photoresist	Materials Technology
	Lawrence Plummer	Plastic device encapsulation	Assembly Equipment
1981	Robert Grey David Manson Wayne Sanborn	Development of silane	Material Technology
	Burton Wheeler	Photorepeating camera	Process Equipment
	Test Systems Group	Sentry test equipment	Test Equipment
1980	Alfred Barsocchi Robert Eberly Donald McKenzie Alfred Taylor	Commercial doping of gasses and mixtures	Materials Technology
	Kazuo Maeda	Low pressure CVD	Process Equipment
	Matt Pennings	Ultrasonic wire bonder	Assembly Equipment
	Sheldon Weinig	High purity, highly characterized materials	Materials Technology
1979	Walter C. Benzing Mike McNeilly	Epitaxial silicon deposition	Process Equipment
	Jere D. Buckley Harold Helmstreet David Markle Abe Offner	MICRALIGN projection mask aligner	Process Equipment
	Frederick W. Kulicke, Jr.	Wire bonding and die attach	Assembly Equipment
	Robert Lorenzini	Silicon crystal growth	Materials Technology
	Nicolas DeWolfe	Automatic semiconductor	Assembly Equipment
	Henry W. Gutsche	Vapor deposition of polycrystal silicon	Materials Technology
	Geoffrey Ryding	Ion implantation equipment	Process Equipment

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SEMI Award North America Recipients