downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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March 3, 2021

University Students Help Shape Flexible Electronics Innovation at FLEX Conference 2021

New treatments for vascular disease. Optimized agricultural production. Beefed up performance of wearable devices and flexible displays.

Four students with their sights set on making the world a better place won Innovators of the Future awards at the 20th Annual FLEX Conference in late February after presenting novel ideas for advancing flexible electronics in the popular student poster event.

It was clear that all of these young innovators are working on projects with the potential to impact our lives in the near future. Their work is critical to advancing products, devices and basic research in flexible electronics.

Posters created by the 17 students who competed for the awards were judged by a multidisciplinary panel of industry experts. The posters reflected a broad range of applications enabled by flexible hybrid devices and covered technology for wearables, medical devices and precision agriculture.

Innovators of the Future Award Winners

Innovators Award HerbertRobert Herbert from the Georgia Institute of Technology won first place for his paper Smart and Connected Stent System with Nanomembrane Soft Sensors for Wireless Monitoring of Hemodynamics. Vascular diseases are the leading cause of death worldwide, accounting for over 30% of all fatalities. Early diagnosis and monitoring blood pressure and flow rates are critical to effective treatment. Herbert’s poster introduced a less costly, less invasive and more revealing (spoiler alert) sensor system that uses a flexible, wireless biosensor system with an inductive medical stent and capacitive pressure sensors.

The laser-machined stent uses multi-layered material integration to function as an inductive coil for wireless communication while maintaining mechanical properties similar to conventional vascular stents. The stent and sensor system can be easily deployed using conventional catheter procedures. Watch his presentation.

Jose Waimin from Purdue University’s School of Materials Engineering Jose Waimin from Purdue University’s School of Materials Engineering was one of two second-place winners for his poster that shows how real-time monitoring of ion concentration, moisture, pH, microbial activity and other key metrics in agricultural production can optimize crop yields while reducing environmental impacts.

His work presented a scalable alternative for manufacturing low-cost flexible sensors that can be used in an array of applications. Electrodes are manufactured in a Roll-to-Roll (R2R) process to enables fast production at a very low cost per device. Watch his talk.

Benham Garakani from Binghamton UniversityBenham Garakani from Binghamton University, Center for Advanced Microelectronics Manufacturing (CAMM) was the other second-place winner for his paper Electromechanical Behavior of Flexible Silver Paste and Highly Stretchable Liquid Metal for Wearable Electronics. Garakani explored how to improve fabrication of reliable, comfortable wearable devices to boost performance and functionality using substrates such as nonwoven high-density polyethylene fibers (HDPE) and thermoplastic polyurethane (TPU).

Garakani also examined the electromechanical reliability of screen-printed silver trace on HDPE fibers and stencil-printed liquid metal (Ga-In-Sn alloy) on TPU during isothermal fatigue cycling. Watch his presentation.

Sridhar Sivapurapu from the Georgia Institute of TechnologySridhar Sivapurapu from the Georgia Institute of Technology won third place for his poster Flexible and Ultra-Thin 30µm Glass Substrates for RF and mmWave Flex Applications. Sivapurapu’s poster addressed the increasing demand for maximizing the mechanical flexibility of flexible displays while maintaining or improving their electrical performance.

Sivapurapu focused on both electrical and mechanical properties for determining the viability of ultra-thin glass stack-ups for flexible RF applications by benchmarking the electrical performance of the ultra-thin glass stack-up to 110 GHz. He also examined electrical characterization during bending tests using free arc bending. Watch his talk.

The Innovators of the Future award was sponsored by FlexEnable, a technology provider that develops flexible organic electronics technologies and OTFT materials.

All FLEX Conference 2021 presentations are available through March 26, 2021 by registering for the event.

Gity Samadi is co-chair of the FLEX Conference student poster awards and program manager at SEMI FlexTech.