November 16, 2022
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
Time
8:00 am - 9:00 am
Location
Virtual, Online,
United States
Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
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