April 16, 2024 - April 17, 2024
Presented by
Hosted by
Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.
Time
7:30 am - 6:00 pm
Location
Binghamton University, Innovative Technologies Complex (ITC)
85 Murray Hill Rd
Vestal, NY 13850
United States
SEMI NBMC Technical Gap Analysis Workshop - Tues. 4/16 - 8 am-6 pm
During this workshop, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast, and lunch will be included and reception at the end of the day will be included.
SEMI FlexTech FHE Technical Gap Analysis Workshop - Wed. 4/17 - 8 am-4 pm, followed by tours of Binghamton University labs
Attendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Breakfast, lunch and tours of Binghamton University lab tours will conclude the day.
Binghamton University Tours - Wed. 4/17 - 4:00pm - 5:30pm
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).
Binghamton University 2024 Art of Science Exhibit - Wed. 4/17 - 4:00pm - 5:30pm
Binghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually. The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced, and refreshments will be served.
In addition:
NextFlex Workshop– Thurs, 4/18
NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon to be announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.
Additional information and separate registration.
SEMI members who wish to join the NextFlex Workshop on April 19th should contact mfabiano@semi.org for a special discount code.
Agenda
Tuesday, April 16
Registration and Breakfast
Opening Remarks
Vision and Mission of NBMC
NBMC Gap Analysis Workshop - AFRL Perspective
Energy Harvesting for Wearables
A Fully Integrated Wearable Ultrasound System to Monitor Deep Tissues in Moving Subjects
Break
Low-cost, Connected Blood Collection Device with Onboard Biosensors to Detect Biomarkers for Human/Cognitive Performance
Smart Remote Patient / Airmen Monitoring (RPM / RAM) Platform
Multiplexed Wireless Interstitial Fluid Monitoring Devices for Stress Assessment
Transdermal Optical Microneedle Sensors for Continuous Monitoring of Physiological Analytes in Interstitial Fluid
Liquid Metal Embedded Elastomers: Electromigration Characterization and Use in Stretchable Sensors
Liquid Metal Filled Fibers for Next Generation E-Textiles
Auricular Bioelectronics for Medicine and Augmented Human-Machine Cognition
Individualized Focused Ultrasound Stimulation of the Brain to Enhance Alertness and Cognitive Performance
Networking Lunch
Breakout Strategy Sessions
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
Break
Breakout Sessions Readout
Networking Reception
Wednesday, April 17
Registration and Breakfast
FHE Consortium Mission and Vision
Advancements in Scalable Anisotropic Adhesive for FHE Manufacturing
Bending the Future: The Expanding Horizons of Flexible Hybrid Electronics
HASEL Artificial Muscles: High Performance Electrostatic Transducers Enabled by the Combination of Flexible Electronics and Liquid Dielectrics
Break
Materials and Processes for High Volume Integration of Stretchable Circuits into E-Textile
Breaking Through 10 Micron Barrier to Enable 3D Structuring of RF Antennas Interconnects Arrays for FHE
Aerosol Printing with Industrial Reliability - Performance Results for the NanoJet Gen2 Printhead
Revisiting Transparent Antennas for 5G and Beyond - FT19-21-203
Minimum Viable Virtual Fab for Accelerated Innovation of Semiconductor Manufacturing Processes and Future Devices
Printed RF Passive Sensors for High-Temperature Applications in Aerospace
AI Models for Optimizing FHE Printing Aided by Ultrasound Metrology
Additively Manufactured Flexible " Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next Generation 5G/mm Wave System on Package Designs
CogniWorm: Compliant and Autonomous Grub for Navigation and Inspection fo Warped, Complex and Rough Environments
Networking Lunch
Breakout Strategy Sessions
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
Break
Breakout Sessions Readout
Binghamton University Laboratory Tours & 2024 Art of Science Exhibit and Reception
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).
Registration
Registration Fee
(April 16 & 17 only)
$250 members
$399 non-members
SEMI members who wish to join the NextFlex Workshop on April 19th should contact mfabiano@semi.org for a special discount code.
Cancellation Policy
Cancellations received on or before March 16, 2024, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 16, 2024, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at mfabiano@semi.org.
Sponsors
Event Contact
For questions, please contact Michelle Fabiano at mfabiano@semi.org.