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February 21, 2024 - February 23, 2024

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The Heterogeneous Integration Roadmap activities are sponsored by IEEE Electronics Packaging Society (EPS), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap. A document with definition of the mission, purpose, structure and governance for this Heterogeneous Integration Roadmap program was prepared and approved.

Time

1:00 pm - 5:00 pm

Add to Calendar 2024-02-21 13:00:00 2024-02-23 17:00:00 Heterogeneous Integration Roadmap Symposium The Heterogeneous Integration Roadmap activities are sponsored by IEEE Electronics Packaging Society (EPS), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap. A document with definition of the mission, purpose, structure and governance for this Heterogeneous Integration Roadmap program was prepared and approved. Samsung Electronics Campus 3655 N First Street San Jose, CA 95134 United States SEMI.org contact@semi.org America/Los_Angeles public
Location

Samsung Electronics Campus
3655 N First Street
San Jose, CA 95134
United States

Learn more here
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