March 6, 2024 - March 7, 2024
Advanced Packaging and Material Characterization
*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar
Participating Fee:
Usual Member Rate: SGD 750
Usual Non-member Rate: SGD 935
*The above rates are inclusive of coffee/tea breaks and luncheon for both days
Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.
A certificate of completion will be awarded at the end of the seminar.
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
- HRDC Approval Letter for Penang Business Summit
- Allowable Cost Matrix
- HRDC SBL Grant Helper
- HRDC SBL Claim Helper
Contact us for enquiries!
For Program:
Ms. Cecelia Fong | cfong@semi.org | +65.9750.2382
For Registration / HRDC Claims:
Ms. Gillian Lim | glim@semi.org | +65.9048.1123
Location
Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia
This course will cover:
- Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
- Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
- Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
- Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
- Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
- Material characterization from bulk to interfaces for Microelectronics packaging
Why should I attend?
- Gain technical knowledge for industry professionals
- Enhance knowledge in manufacturing and R&D know-how in IC packaging
- Apply Key Technical Concepts in Problem Solving through Real Case Studies
- Networking opportunities with industry peers
Who should attend?
- Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
- Useful for sale or application engineers who supply packaging materials and tools to the industry
BROWSE OUR PHOTO GALLERY
Featured Speakers
Agenda
Introduction to IC Packaging & Interconnects
Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging
Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding
Lunch
Board Assembly and Soldering & PCB and IC Carriers
Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution
PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development
Q&A | Case Studies
End of Day 1
Assembly Process
• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism
Lunch
Material Characterization Techniques
• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear
Q&A | Case Studies
Lucky Draw
End of Workshop
Note: Program is subject to changes.
Seminar 1 and Seminar 2 timing will overlap on 7 Mar .
Sponsors
Supporting Partners
