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  • Statement of Interest – Beginning on February 28, 2023, all potential applicants can submit a Statement of Interest (SOI), which will be reviewed on a rolling basis. The SOI will allow CPO to gauge interest in the program, assess the types of projects and applicants, and prepare for application review. SOIs must be submitted at least 21 days prior to full applications.
     
  • Pre-Application – The Pre-Application is optional but strongly recommended because it will enable CPO to start a dialogue with applicants and provide feedback prior to the submission of full applications. Leading-edge project applicants may submit pre-applications starting March 31, while current-generation, mature-node applicants will be able to do so starting May 1. The decision was made to start with leading-edge applications because of the time it will take to review them, but CPO was careful to note that this does not mean that there is a risk to such projects receiving all the available funding.
     
  • Due Diligence – If CPO determines that an application merits funding, it will work with the applicant on a Preliminary Memorandum of Terms and begin validating national security, financial, and other information.
     
  • On National Environmental Policy Act (NEPA) Requirements - Meeting NEPA requirements is a critical part of the successful application process. CPO encourages applicants to start working on NEPA requirements now so that they can produce the necessary environmental studies in a timely manner and help DOC expedite the NEPA process.
     
  • Award Issuance – Following due diligence, CPO will prepare and issue awards for applications selected for funding. Funds will not be dispersed in one lump sum, but will instead be spread over multiple dispersals tied to specific project milestones. These milestones will vary by project and will be determined during the application process.

Today, the CHIPS Program Office (CPO) released a series of supplemental materials intended to provide additional guidance for CHIPS funding applicants. SEMI previewed these materials in our initial summary of the Notice of Funding Opportunity (NOFO) for commercial fabrication facilities.

  1. Pre-Application Materials:
    The Pre-Application is optional but strongly recommended because it will enable CPO to start a dialogue with applicants and provide feedback prior to the submission of full applications. Leading-edge project applicants may submit pre-applications starting March 31, while current-generation, mature-node, and back-end applicants will be able to do so starting May 1. Specific materials released include the following:
  2. Full Application:
    This will be the application that is merit reviewed and will include the most comprehensive project proposals. The earliest submission date for leading-edge applicants is March 31 while current-generation, mature-node, and back-end applications may be submitted starting June 26. Specific materials released include the following:
  3. Workforce Development
    • Applications must include a workforce development plan that aligns with the Administration’s “Good Jobs Principles”; enables the recruitment, hiring, training, and retention of a diverse and skilled manufacturing and construction workforce; proactively includes women and economically disadvantaged individuals; engages with community partners, including leading labor unions, other workforce development organizations, and educational institutions; and provide access to affordable, accessible, reliable, and high-quality childcare for facility and construction workers. The CHIPS Program Office has released a Workforce Development Planning Guide as a resource for NOFO applicants.
       
    • In addition to these resources, the CHIPS Program Office has announced a series of webinars that will provide prospective applicants the opportunity to ask questions directly to Program officials.
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Understanding the CHIPS Act: How it Impacts the Semiconductor Industry