downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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DRESDEN, Germany — March 26, 2024 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems. Registration is open.

Themed Heterogeneous Systems for the Intelligently Connected Era, this year’s SEMI 3D & Systems Summit will feature a broader scope of topics including market trends, chiplet design, hybrid bonding, Co-Packaged Optics (CPO), high-bandwidth computing and environmental sustainability.

“We look forward to hosting the most prominent names in 3D integration microelectronics manufacturing to showcase their latest products and technologies at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “With advanced packaging innovations critical to enabling environmental sustainability while increasing chip performance, we look forward to hosting experts who will discuss the microelectronics industry’s work to explore more eco-friendly alternatives to conventional materials.”

3D Summit Sessions

Session 1: Semiconductor Market Trends and European Impact
Executive leaders will analyze the dynamic relationship between global semiconductor trends and the European landscape, highlighting the implications for Europe’s economic expansion and technological progress.

Session 2: Chiplet System Architectures – Design and Technologies
Industry experts will delve into dynamic chiplet design, emphasizing innovative approaches, emerging trends, optimization strategies, and packaging solutions that drive chiplet innovations.

Session 3: Hybrid Bonding Technologies for Advanced 3D Integration
Specialists will spotlight the latest advancements in hybrid bonding technologies, focusing on recent developments, novel techniques, and emerging applications. Speakers will highlight hybrid bonding’s transformative potential for enhancing semiconductor performance and overall functionality.

Session 4: Manufacturing Innovation for 3D Integration
Visionaries will showcase the newest hybrid bonding advancements, emphasizing their potential to enhance chip performance, efficiency, and functionality through recent innovations and emerging applications.

Session 5: Co-Packaged Optics (CPO) – Innovations for High Bandwidth Computing
Leaders will explore CPO as an advancement in integrated photonics, highlighting its cost-effectiveness, enhanced integration, and potential to improve performance in data transmission and processing systems.

Session 6: Materials and Processes Supporting Environmental Sustainability
Experts will spotlight semiconductor industry efforts to prioritize environmental sustainability through collaboration, innovation, and a continued commitment to exploring eco-friendly alternatives and reducing the industry’s environmental footprint.

Global Leaders to Present

3D & Systems Summit presenters include experts from these global leaders:

  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • KLA Corporation
  • MKS-Atotech
  • Silicon Saxony
  • SPTS Technologies Ltd., a KLA company
  • STMicroelectronics
  • TechSearch International, Inc.

Exhibition and Business Networking

The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise.

Networking Dinner registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form

3D Summit premium sponsors: Adeia, ASE, Comet Yxlon, EV Group, Heidenhain, imec, KLA, Lam Research, and MKS-Atotech.

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe onX or LinkedIn @SEMIEurope (#3DSummit).

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11

Michael Hall/SEMI US
Phone: 1.408.943.7988