SAN FRANCISCO – July 10, 2023 – SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2023 on Thursday, July 13.
Presented by SEMI Americas and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The following Best of West 2023 finalists will showcase their products at their booths on the SEMICON West 2023 show floor:
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Lam Research: Selective Etch Products Collaborating closely with its customers, Lam Research developed an innovative suite of selective etch products – Argos®, Prevos® and Selis®. This product portfolio applies breakthrough wafer fabrication techniques and novel chemistries to support chipmakers in the creation of their advanced logic and memory solutions for a smarter, more connected world. Booth W4 |
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Onto Innovation: Echo Opto-Acoustic Metrology System The Echo™ opto-acoustic metrology system delivers non-destructive wafer-level metrology for measurements of single and multi-layer opaque films ranging in thickness from 50Å to 35µm. It utilizes Picosecond laser ultrasonic (PULSE™) technology, a semiconductor industry workhorse for over 20 years that provides comprehensive metal film thickness metrology. Booth 629 |
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SPEA S.p.A.: DOT Tester Auto Maintenance Featuring a combination of smart sensors, artificial intelligence, and instrument architecture, the DOT Testers Auto Maintenance feature enables semiconductor test equipment to autonomously run complete diagnostics and calibrations. The product preserves normal tester operation and requires no operator intervention. Booth 1161 |
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Santec: High-Accuracy Wafer Thickness Mapping System TMS-2000 The TMS-2000 maps the thickness distribution of semiconductor wafers with sub-nanometer repeatability even under conditions of temperature instability or environmental vibrations, circumstances where conventional wafer thickness mapping techniques may struggle. The system captures key wafer flatness measurements including global flatness, site flatness and edge flatness. Booth 1840 |
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