SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and visionaries gather September 5 at the Suwon Convention Center for insights into critical themes including advances in high-performance computing (HPC). Registration is open.
Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.
Session 1: High-Performance Computing
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Wu Xin, Corporate Vice President, Silicon Technology |
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Ki Ill Moon, Vice President, Head of Packaging Technology Development |
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Donghan Kim, Sr. Staff and Head of Strategy Collaboration Solution Development |
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Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly |
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Session 2: Interconnection Technology for High-Performance Computing
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Jongsoo Choi, Principal Professional |
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Vikas Dubey, Senior Scientist Systems Packaging |
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Dongshun Bai, Senior Technologist and Business Development Director |
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SeokHo Na, Master, Sr. Director of R&D |
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A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.
Advanced Packaging Summit Sponsors
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· KLA |
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· PROTEC |
· SIMMTECH |
· TEL |
About SEMI
SEMI® connects 3,000 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.
Association Contacts
Jaegwan Shim/SEMI Korea
Phone: 82+2.531.7804
Email: jshim@semi.org
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org