downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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MRSI, a part of Mycronic Group, will exhibit our family of die bonders and present at the 24th China International Optoelectronic Exposition (CIOE) from September 6-8th, 2023 at the Shenzhen World Exhibition and Convention Center. MRSI Mycronic will demonstrate how our products and services can meet the needs of various markets, such as datacom, LIDAR, medical, and high performance laser diodes, and chiplets.

At the exhibition, MRSI Mycronic will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment applications. The MRSI-H-HPLD+ significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. It can handle a wide range of die sizes and substrates, and can achieve high accuracy with high-speed eutectic bonding.

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing, and Packaging Technology Forum on September 7, 2023. He will share his insights on the challenges and opportunities of optoelectronic chip assembly in the context of artificial intelligence.

“MRSI Mycronic has been a leader in die bonding solutions for 40 years, serving customers across various industries and applications. We are proud to showcase our latest innovations and achievements at CIOE 2023, and we look forward to meeting with our existing and potential customers in China and beyond,” said Dr. Zhou.

For more information about MRSI Systems and to schedule a demo, please visit or contact

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd.
Tel: +86 135 0289 9401

About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit

About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm.