The SEMI Billings Report provides a first look at the billings trends for North American Headquartered Semiconductor Equipment Manufacturers. The three-month average global billings are a strong indicator for trends in the worldwide semiconductor industry. SEMI follows the protocol established by the U.S. Department of Commerce in publishing our figures only on a three-month average basis. We do this in order to smooth out the natural volatility in billings. This report is distributed monthly approximately three weeks after the close of each month. Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Click here for more information.
2023 North America Semiconductor Equipment Billings Report Release Dates
Important: Dates are subject to change; Report is released at 3:00 pm Pacific Time.
| January 23 | July 25 |
| February 21 | August 24 |
| March 21 | September 20 |
| April 25 | October 24 |
| May 23 | November 21 |
| June 21 | December 20 |
Notice Regarding the Billings Press Release
SEMI ceased publishing monthly press release for the North America Semiconductor Equipment Billings report in February 2022.
Notice Regarding the Book-to-Bill Report
SEMI ceased publishing the monthly North America Book-to-Bill report in 2017. The December 2016 report and press release marked the last publication of bookings data. The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program became an unnecessary component of their industry analysis.
SEMI continues to publish a monthly billings report that compares month-to-month and year-over-year trends billings activity of equipment companies based in North America. Additional detailed billings data will also be available in the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that SEMI prepares in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings and bookings data by 24 equipment segments and by 7 end market regions.
SEMI also tracks semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1000 fabs worldwide.
Additional Benchmarking Tools
The SEMI Market Information team provides tools to help you benchmark the industry.
World Fab Forecast
A comprehensive fab database containing over 1,000 records and details by fab. Includes forecast on a quarterly basis on capacity, construction and equipment spending, wafer size, and technology node. Click here for more information.
Materials Market Data Subscription
An excellent source of regional semiconductor materials data including fab materials and packaging materials from global companies on a quarterly basis. Includes a three-year forecast as well as current and historical revenue data. Click here for more information.