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This collection contains presentations by Nao Ando, Chief Designer of R&D at YUASA System, Doug Hackler, President and CEO of American Semiconductor, Kei Hyodo, Manager at Konica Minolta, Inc., and Neil Bolding, Technical Manager at MacDermid Autotype, which were given during the 2017 FLEX Convention in June 2017 in Monterey, CA.

“Accurate Testing of Flexible Hybrid Electronics Using Tension-Free Systems” details FHE’s that are inplantable, patchable, wearable, comfortable, curved, and can survive an endurance test. In particular, metallic foil and stretchable wire sheets are subjected to mathematical torsion (tension-free), with showcased results.

“Advances in Flexible Hybrid Electronics Reliability” explores FleX-ICs (flexible silicon-based ICs) and their applications in IoT, wearable devices, and structures, featuring improved reliability (no die cracking and reduced breakage of interconnects). Tests are shown, notably, radius of curvature, dynamic reliability, torsion, and data retention.

“Overview of IEC Activities Related to FHE, including IEC TC 110 and TC 119” introduces the International Electrotechnical Commission (IEC) and its partners internationally, regionally, nationally, and in forum. Numerous electronic display devices are listed (including LCDs, OLEDs, 3DDDs, and more) as related to published and under-development standards of the IEC. The IEC’s mission is to prepare standards of terms and definitions, letter symbols, essential ratings and characteristics, measuring methods and related test methods, and reliability testing methods for flexible display devices.

“Recent Developments in IPC Printed Electronics Standards” lists IPC’s published standards for printed electronics. New designations and terms are introduced, along with requirements and guidance, materials specifications, specification for bare substrates, characteristics for substrates, a materials database, test methods/procedures, and next steps. In particular, this presentation also details e-textiles.

 

Keywords: FHE, Reliability, IoT, Wearable Devices, OLED, OEM, Substrate, E-textiles, Standards, Torsion, Regulations, Interconnects, Characterization, Reliability, Materials