Beijing KHL Technical Equipment Co. Ltd.
Jul 31, 2016
270428
Independent research and development and design of semiconductor processing equipment (mainly three types of products: wafer processing equipment, laser equipment and automation equipment. Wafer processing equipment mainly includes wafer chamfering machine, wafer cleaning machine, wafer throwing machine, wafer contour Instruments, etc.; laser equipment mainly includes wafer coding machine, wafer level packaging coder, wafer cutting machine, IC marking machine, etc.; automation equipment mainly includes wafer handling sorting equipment, IC Handler equipment, ceramic disc handling Robot, fully automatic wafer typewriter, laser dicing machine, IC package laser coder, fully automatic wafer edging machine / wide sand machine / visual inspection instrument, etc.)
主要生产半导体加工设备(全自动晶圆打字机、激光划片机、IC封装激光打码机、全自动晶圆磨边机/宽砂机/目检仪等)
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Assembly/Packaging Equipment
Keywords
晶圆激光打码机, 晶圆倒角机, 晶圆清洗机, 晶圆抛边机, 晶圆轮廓仪, 晶圆切割机, IC打标机, 全自动晶圆分选机, 晶圆全自动搬运机, IC封装激光打码机
Room 103,Hong Kun Yun times C,Kechuang 12 Street,
Beijing Economic and Technological Development Zone
Beijing
101111