Ehwa Diamond Industrial Co., Ltd.
Dec 15, 1999
12792
Diamond tool for wafer backgrinding, CMP, sawing and package sawing(backgrinding wheel, CMP conditioner, dicing blade, micro blade).
Primary Industry
Manufacturing Equipment (OEM)
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Parts
Website
374, Nambu-daero
Osan-si, Gyeonggi-do
18145