HPSP LTD.
Mar 25, 2021
1043525
HPSP, a trusted partner of the world’s leading semiconductor companies, is at the heart of the silicon roadmap. In fact, almost all advanced chips today are made with HPSP technology.
HPSP develops, markets, manufactures, and services a proprietary High Pressure Anneal Process (HPAP) system that combines the benefits of traditional batch furnace and high pressure (up to 25ATM) processing capabilities in various ambience.
With HPAP, thermal budget can be lowered to improve performance for 14nm & beyond devices – Logic (Si, SiGe, III-V), Memory (3D NAND) & CIS.
HPSP product, GENI-SYS, enables applications from HPA to wet oxidation for various devices.
HPSP develops, markets, manufactures, and services a proprietary High Pressure Anneal Process (HPAP) system that combines the benefits of traditional batch furnace and high pressure (up to 25ATM) processing capabilities in various ambience.
With HPAP, thermal budget can be lowered to improve performance for 14nm & beyond devices – Logic (Si, SiGe, III-V), Memory (3D NAND) & CIS.
HPSP product, GENI-SYS, enables applications from HPA to wet oxidation for various devices.
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Deposition
Website
65, Omokcheon-ro 152 beon-gil
Suwon-si
Gyeonggi-do
16642