JTEKT MACHINE SYSTEMS CORPORATION
May 9, 2022
152607
Three processes in a production line (Lapping→Obverse Side Grinding →Reverse Side Grinding) are integrated into one machine.
Both sides are simultaneously ground for each wafer and allows to store and traceability of grinding data for each wafer.
Cassette transfer can be handled by OHT.Double Disc Wafer Grinder that can be replcaced from the lapping machine.
Both sides are simultaneously ground for each wafer and allows to store and traceability of grinding data for each wafer.
Cassette transfer can be handled by OHT.Double Disc Wafer Grinder that can be replcaced from the lapping machine.
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南植松町2-34
八尾市
5810091